Engineering Design: Inter-layer prepreg arrangement should be corresponding. Multi-layer board and prepreg should use the same supplier product. The Outer c/S surface graphics area as close as possible, you can use a separate grid. Baking board before cutting: Usually 150 degrees 6 - 10 hours, remove the water vapor inside the board to [...]
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HDI is an abbreviation for High Density Interconnector. It is a production of printed circuit board technology. The use of micro-blind buried technology and a circuit distribution of high density circuit board.HDI is a compact product designed for small capacity users.It uses a modular parallel design ,a module capacity of 1000VA (height 1U), [...]
According to statistics, more than a quarter of the world's manufactured industrial defective products are related to dampness every year。The production of electronic industrial products and product storage environment humidity should be below 40%.Some varieties also require lower humidity. IC: Damp on the semiconductor industry, the main hazards in the wet through the [...]
The full name of OSP is Organic Solderability Preservatives. Also known as Preflux.Simply put OSP is on a clean bare copper surface,To chemical method to grow a layer of organic film. This layer of film with anti-oxidation, thermal shock resistance and moisture resistance .Used to protect the circuit board copper surface in the normal environment [...]
Quick Details Base Material:FR-4 Copper Thickness:1 Oz Board Thickness:1.6mm Min. Hole Size:0.10mm Min. Line Width:0.1mm Min. Line Spacing:0.1mm Surface Finishing:HASL Lead Free Solder Mask:Green Service:One-stop Laser Drilling Hole Size:0.1mm Impedance Control V-scoring:±10% Lead time:5-7working days Outline Tolerance:±0.10mm Silk screen:White Application:LED strips,LED display,CCTV Our service: PCB manufacturing Professional components sourcing Assembly Functional test [...]
Kingford Marketing Director Mr Ripple Miao attended the 17th Iran International Power Exhibition in Iran held at the Tehran International Ground Exhibition. The Exhibition took place from November 4 to 7. He also visited our Iranian business partners. Through this trip to Iran, we have promoted the exchange between us and our customers, and at the same [...]