Automotive central control screen display PCB assembly
PCB Assembly Name:Automotive central control screen display PCB assembly
Surface Finishing:HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing:X-ray, Aoi
Flame Retardant Properties:V0
Processing Technology:Electrolytic Foil
Insulation Materials:Organic Resin
Material:Complex
Applicaton:Industrial PCB PCBA
Transport Package:Packed in Carton
Specification:Copper
Layer:1-18 Layer
Copper Thickness:0.5oz-6oz
Board Thickness:0.2mm-4mm
Min.Hole Size:0.1mm (4 Mil)
Min.Line Spacing:0.1mm (4 Mil)
PCBA QC:X-ray, Aoi Test, Function Test(100% Test)
Specialised:Consumer, LED, Medical, Industrial, Control Board
Delivery:PCB, 7-10 Days;PCBA, 2-3weeks
Service:PCBA/PCB Assembly/PCB Circuit Board
Other Service:PCB/PCB Layout and Design, Engineering Support
Automotive Electronics Turnkey PCB Assembly
PCB Assembly Name:Automotive Electronics Turnkey PCB Assembly
Surface Finishing:HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing:X-ray, Aoi
Flame Retardant Properties:V0
Processing Technology:Electrolytic Foil
Insulation Materials:Organic Resin
Material:Complex
Applicaton:Industrial PCB PCBA
Transport Package:Packed in Carton
Specification:Copper
Layer:1-18 Layer
Copper Thickness:0.5oz-6oz
Board Thickness:0.2mm-4mm
Min.Hole Size:0.1mm (4 Mil)
Min.Line Spacing:0.1mm (4 Mil)
PCBA QC:X-ray, Aoi Test, Function Test(100% Test)
Specialised:Consumer, LED, Medical, Industrial, Control Board
Delivery:PCB, 7-10 Days;PCBA, 2-3weeks
Service:PCBA/PCB Assembly/PCB Circuit Board
Other Service:PCB/PCB Layout and Design, Engineering Support
Automotive Control Module PCB Assembly
PCB Assembly Name:Automotive Control Module PCB Assembly
Surface Finishing:HASL, Enig, OSP, Immersion Au, AG, Sn
PCBA-Testing:X-ray, Aoi
Flame Retardant Properties:V0
Processing Technology:Electrolytic Foil
Insulation Materials:Organic Resin
Material:Complex
Applicaton:Industrial PCB PCBA
Transport Package:Packed in Carton
Specification:Copper
Layer:1-18 Layer
Copper Thickness:0.5oz-6oz
Board Thickness:0.2mm-4mm
Min.Hole Size:0.1mm (4 Mil)
Min.Line Spacing:0.1mm (4 Mil)
PCBA QC:X-ray, Aoi Test, Function Test(100% Test)
Specialised:Consumer, LED, Medical, Industrial, Control Board
Delivery:PCB, 7-10 Days;PCBA, 2-3weeks
Service:PCBA/PCB Assembly/PCB Circuit Board
Other Service:PCB/PCB Layout and Design, Engineering Support
- PCB Assembly Equipment
- PCB Assembly Capability
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |