What are the main difficulties in making multilayer PCB board
Traditionally, we define PCB boards with more than 4 layers as "multilayer PCB boards", an...
Traditionally, we define PCB boards with more than 4 layers as "multilayer PCB boards", an...
There will be engineering review and approval of your information, if there is a problem with the fi...
It is easy to determine that the IC is damaged. These changes are not necessarily caused by the IC d...
Width and spacing of printed wire are important design parameters, which affect not only the electri...
Every accessory of the hot product is the vane of the quality of the hot product. Besides the qualit...
Only each module has good EMC and low EMI can ensure the realization of the whole system function.
Because the wider the printed line is, the smaller the inductance is, the lead line from the pad to ...
PCB copy board process some small principles :1, printed wire width selection basis: 2, line spacing...
Why is lead not allowed on printed boards, assembly processes and products? There are two reasons fo...
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ cri...
The reasons for component displacement in patch processing are as follows: 1, the use time of solder...
During the installation of the reinforced frame and the PCBA, and the installation of the PCBA and t...