News & Resource

/News & Resource

We will attend electronica 2018!

Welcome to visit our booth 175-6 Hall A1 at electronica 2018!  Electronica 2018 will be held from 13th-16th, November in Neue Messe München | Messegelände, 81823 München, Germany. Kindford will attend this exhibition, welcome to visit our booth 175-6 hall A1, we will here wait for you! Waitting for you here to have a [...]

We will attend electronica 2018!2018-10-23T02:23:23+00:00

How to improve the thermal reliability of PCB

In general, the copper foil distribution on PCB board is very complicated, and it is difficult to model accurately. Therefore, it is necessary to simplify the shape of wiring and make the electronic components on the board of ANSYS model, which are close to the actual circuit board, to be simulated by simplified modeling, [...]

How to improve the thermal reliability of PCB2018-08-07T04:08:16+00:00

China PCB Assembly SMT Assembly

a thru-hole component is described as a component leaded with a wire or a metallic lead that is mounted to the board by placing the lead though plated holes in the board and then soldered. The quality of the solder joint is important for several reasons. The solder joint is the actual connection between [...]

China PCB Assembly SMT Assembly2018-08-07T04:08:16+00:00

Printed circuit board ball grid array

PCB BGA A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package, each pin is provided with a solder [...]

Printed circuit board ball grid array2018-08-07T04:08:16+00:00

Small Talk about PCBA Soldering Issues and Improve Rework Process.

EMS factory continually face the need to rework and repair the PCBA.Many issues comes,such as insufficient solder,or excessive solder,or missing component on the board,or other issues.With continues trend toward miniaturization in the electronics industry,the component size will be placed and assembled onto board with finer pitch and space.Thus it will increase the rework and [...]

Small Talk about PCBA Soldering Issues and Improve Rework Process.2018-08-07T04:08:16+00:00

SMT chip processing need to pay attention to some of the issues

The development of SMT patch processing has brought an innovation to the entire electronics industry. Especially in the current environment. People pursue the miniaturization of electronic products. The perforated plug-in components used in the past can not be reduced to result in the large size of the entire electronic product. But nowaday, SMT patch [...]

SMT chip processing need to pay attention to some of the issues2018-08-07T04:08:16+00:00

Some issue of Welding quality problems

1.The solderability of the circuit board hole affect the quality of welding The solderability of the circuit board hole is not good, and it will cause the false weld defect, which will affect the parameters of the components in the circuit, leading to the instability of the multilayer component and the inner layer wire, [...]

Some issue of Welding quality problems2018-08-07T04:08:18+00:00

The Forms And Replacement Of RoHS-restricted Six Harmful Ingredients.

The forms and replacement of RoHS-restricted six harmful ingredients. 1.Lead: Lead is mainly found in lead-containing solders, CRT glass, light bulbs, pigments, solid lubricants, rubber, lead-acid batteries, and PVC heat stabilizers. The solder of the circuit board is a eutectic solder consisting of 63% tin and 37% lead. The melting point of this solder [...]

The Forms And Replacement Of RoHS-restricted Six Harmful Ingredients.2018-08-07T04:08:18+00:00

The Development of China’s printed Circuit Board Industry will enter the period of High Speed growth

With the rapid development of electronic products, the price war has changed the structure of supply chain. China has become the most important PCB manufacturing base in the world because of its industrial distribution, cost and market advantages.  The output value of China's printed circuit board industry has maintained the position of first in the [...]

The Development of China’s printed Circuit Board Industry will enter the period of High Speed growth2018-08-07T04:08:18+00:00

7 ways to avoid the warpage for high quality PCB

There are 7 ways to avoid the warpage of PCB Engineering design     The arrangement of inter-layer prepreg should be symmetrical, such as the 6 layers whose the thickness of the 1~2 and 5~6 layers and the number of the prepreg should be the same, otherwise the laminates will be warped easily; the multilayer [...]

7 ways to avoid the warpage for high quality PCB2018-08-07T04:08:18+00:00