Air conditioner controller DIP processing
Name: Air conditioner controller DIP processing
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station
Placement speed: chip component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, Flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
dip plug-in processing manufacturers
Name: dip plug-in processing manufacturers
PCB Type: Rigid Circuit Board
Dielectric: FR-4Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Quality Grade: Ipc Class 2, Ipc Class 3
Brand Of Laminate: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers
PCB Layers: 1~30 Layer
Board Thickness: 0.1~8.0mmBoard Thickness
Tolerance: ±0.1mm / ±10%
Surface Finishes: OSP, HASL, HASL Lf, Immersion Gold, Etc.
Solder Mask Colors: Green, Red, White, Black, Blue, Yellow, Orange
Silkscreen Colors: Black, White, Yellow, Etc.
Electrical Testing: Fixture / Flying ProbeOther
Testing: Aoi, X-ray(Au&Ni), Controlled Impedance Test
Module patch plug-in processing
Name: Module patch plug-in processing
PCB Type: Rigid Circuit Board
Dielectric: FR-4Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Quality Grade: Ipc Class 2, Ipc Class 3
Brand Of Laminate: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers
PCB Layers: 1~30 Layer
Board Thickness: 0.1~8.0mmBoard Thickness
Tolerance: ±0.1mm / ±10%
Surface Finishes: OSP, HASL, HASL Lf, Immersion Gold, Etc.
Solder Mask Colors: Green, Red, White, Black, Blue, Yellow, Orange
Silkscreen Colors: Black, White, Yellow, Etc.
Electrical Testing: Fixture / Flying ProbeOther
Testing: Aoi, X-ray(Au&Ni), Controlled Impedance Test
- PCB Assembly Equipment
- PCB Assembly Capability
- PCB Assembly Capability
Item | Process Capability Parameter |
Order Quantity | ≥1PC |
Quality Grade | IPC-A-610 |
Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
Size | 50*50mm~510*460mm |
Board Type | Rigid PCB, Flexible PCB, metal core PCB |
Min Package | 01005 (0.4mm*0.2mm) |
Max Package | No limit |
Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS, etc. |
Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
Component Sourcing | Turnkey (All components sourced by PCBMay), Partial turnkey, Kitted/Consigned |
BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
SMT Parts Presentation | Cut Tape, Partial reel, Reel,Tube, Tray, Laser-cut Stainless Steel |
Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment. |
Stencil | Stencil with or without frame (offered free by PCBMay) |
Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
SMT Capacity | 3 Million~4 Million Soldering Pad/day |
DIP Capacity | 100 Thousand Pins/day |
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |