Energy Storage Module 150W Inverter PCB Assembly
Name:Energy Storage Module 150W Inverter PCB Assembly
Base Material:Copper
Insulation Materials:Epoxy Resin
Model:Energy Storage Module PCB Assembly
PCB Base:Fr-4
Voltage:DC12V
Color:Customized
Transport Package:Packed in Carton
Specification:RoHS, SGS, UL
Origin:shenzhen
Production Capacity:5000PCS/Month
Energy Storage Protection Circuit Module PCB Assembly
Name:Energy Storage Protection Circuit Module PCB Assembly
Specified Types:3-10s Li-ion/Li-Polymer/LiFePO4 Battery
L-Ion/Li-Polymer Charging Voltage:12.6V-42V
LiFePO4 Charging Voltage:10.8V-36V
Max. Continuous Charging Current:150A
Maximal Continuous Discharging Current:150A
Discharge Overcurrent Protection:400±50A(Adjustable)
Colour of PCM:Green
Balance:Yes
Transport Package:Antistatic Bag /White Box and Standard Export Cart
Specification:L230*W140*T35mm
Origin:China Guangdong
Production Capacity:500000/Month
12V to 220v energy storage module PCB Assembly
Name:12V to 220v energy storage module PCB Assembly
Metal Coating:Silver,Copper,Gold,Tin
Mode of Production:SMT
Layers:Multilayer
Base Material:Fr4 Tg130,150,Tg170 /Aluminum
Certification:RoHS, ISO
Customized:Customized
Condition:New
Solder Mask Color:Black、Red、Yellow、White、Blue、Green
Testing Service:Aoi+100% Electrical Test
SMT Efficiency:BGA.Qfp.Sop.Qfn.Plcc.Chip
PCBA Service:One Stop Turnkey PCBA Service
Copper Thickness:1 Oz, 0.5-6oz
Supplier Type:OEM/EMS
Min. Hole Size:0.2mm
Min. Line Spacing:0.075m
Min. Line Width:0.127mm
Layer Available:1-24 Layers PCB Board
Transport Package:Anti-Static Packing
Specification:can make Blind Vias+Controlled Impedance+BGA
Origin:China
Bidirectional inverter module PCB assembly
Name:Bidirectional inverter module PCB assembly
Efficiency: Maximum Efficiency: 94.5%
Function: with PFC function
Reliability: forward and reverse charging and discharging, high reliability
Standard: RoHS Compliant
Output voltage: high output voltage and current accuracy, better than 1%
Weight: Weight≤2.0kg
Size: 260mm×150mm×65mm
Application: outdoor portable power supply; single-phase inverter; UPS, industrial battery charge and discharge
Description: The 2.2kW high-power bidirectional inverter module INV2200-BD circuit realizes digital power factor correction (PFC), forward LLC, and reverse full-bridge SPWM technology into a two-stage topology, realizes the integration of rectification and inverter, and uses MCU at the same time Programmable control of forward and reverse charging control commands, hardware-level and software-level short-circuit protection, and pure sine wave inverter voltage.
- PCB Assembly Equipment
- PCB Assembly Capability
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |