Overlay design and bonding control of high frequency mixed pressure plate

With the rapid development of electronic communication technology, in order to achieve high speed and high fidelity transmission of signals, more and more high-frequency circuit boards are used in communication equipment. The medium material used by the high-frequency plate has excellent electrical properties and good chemical stability, which is mainly manifested in the following four aspects:

1. It has the characteristics of small signal transmission loss, short transmission delay time and small signal transmission distortion.

2. Excellent dielectric properties (mainly: low relative dielectric constant Dk, low dielectric loss factor Df). Moreover, this dielectric property (Dk, Df) maintains its stability in the face of environmental changes in frequency, humidity, and temperature.

3. High precision control with characteristic impedance (Zo).

4. Excellent heat resistance (Tg), formability and adaptability.

Based on the above characteristics, high frequency PCB board is widely used in wireless antenna, base station receiving antenna, power amplifier, components (shitter, confluence, filter), radar system, navigation system and other communication equipment. Multilayer high-frequency plate design, based on cost saving, improving bending strength, electromagnetic interference control and other factors, often in the form of hybrid plate, called high-frequency hybrid plate. The selection of high frequency mixed pressure materials and the design of overlapping combinations are varied, too numerous to list. Based on one or more factors in cost saving, improving bending strength and electromagnetic interference control, the high frequency hybrid laminated plate design must adopt the high frequency semi-cured sheet with low resin fluidity in the pressing process and the FR-4 substrate with smooth medium surface. In this case, there is a greater risk for the cohesiveness control of the product in the pressing process.

When the mixing plate is used, the stability of the connection between the high frequency chip and the mixing plate is poor. Due to the vibration of the body, the high frequency chip will fall off the mixing plate, which will affect the use of the circuit board. The utility model provides the following technical scheme: A high frequency mixed pressure plate, including a mixed pressure plate, a high frequency chip and a fixing device, the outer wall of the mixed pressure plate is installed with wiring feet through the tin plating, the internal concave groove of the mixed pressure plate is provided with a plurality of through holes, the through hole is installed with a metal sheet, the metal sheet and the mixed pressure plate is connected, the high frequency chip is installed in the concave groove, The top of the high-frequency chip is installed with a plurality of metal feet, the metal foot and the through hole corresponding to the position, and the metal foot with the through hole, the fixing device is installed at the bottom of the mixed plate, the fixing device comprises two fixing seat and fixing rod, both ends of the fixing rod is connected with the fixing seat, The fixing rod is in contact with the bottom of the high-frequency chip.

1. The inner wall of the concave groove is inlaid with a heat-resistant ring, and the high-frequency chip is inlaid in the concave groove through the heat-resistant ring.

2. The number of the through holes and the metal feet is five, and the five through holes and the five metal feet present a ring distribution.

3. The right side wall and the left side wall of the mixing plate are respectively installed with three connecting pins.

4. The two fixing seats are provided with through holes inside, and both ends of the fixing rod are inserted into the through holes inside the fixing seat.

Compared with the prior art, the utility model has the advantages that the high frequency mixed pressure plate is arranged and the structure design is reasonable. The metal plate is installed in the through hole at the bottom of the mixed pressure plate, and the heat resistant ring is installed on the inner wall of the concave groove. The combination of the heat resistant ring and the metal sheet can effectively improve the fastness of the connection between the high frequency chip and the mixed pressure plate, so as to improve the stability of the PCB circuit board.