PCB board temperature maximum how many degrees?

In order to ensure the quality of finished PCB, reliability and adaptability tests are required. The temperature resistance test of PCB board is to prevent PCB board bursting, bubbling, delamination and other adverse reactions at too high temperature, leading to poor product quality or direct scrap, which is an issue that needs to be paid attention to. So PCB board temperature maximum how many degrees, how to do heat resistance test? Next, Shenzhen PCB manufacturer kingford will introduce you.

The temperature of PCB board is related to the temperature of its raw materials, solder paste and surface parts. Usually, the highest temperature resistance of PCB board is 300 degrees, 5-10 seconds; Over lead-free wave soldering temperature is about 260, over lead is about 240 degrees.

PCB board heat resistance test

1, first prepare PCB board production board, tin furnace.

Sample 5 pieces of 10*10cm base plate (or pressed plate, finished plate); "(Copper-containing substrate without bubbling stratification).

Substrate: more than 10cycle; Pressed plate: LOW CTE 150 10cycle and above; HTg material more than 10cycle; Normal material at least 5 cycles.

Finished plate: LOW CTE 150 5cycle or above; HTg material more than 5cycle; Normal material at least 3 cycles.

2. Set the temperature of tin furnace at 288+/-5 degrees, and adopt contact temperature measurement and correction.

3, soak with a soft brush for flux, apply to the board face, reoccupy crucible  pliers buccal test board into tin stove, timing out 10 SEC after cooling to room temperature, visual presence of foaming board appear, this is 1 cycle.

4. If the problem of bubbling and bursting plate is found visually, immediately stop leaching tin and analyze the initiation point f/m. If there is no problem, continue the cycle until the bursting plate, with 20 times as the end point.

5. It is necessary to slice and analyze the bubbling place, understand the source of detonation point, and take pictures.

PCB board in overheating temperature will produce some bad problems, so for different materials of PCB board temperature resistance, it is necessary to understand in detail, do not exceed the maximum limit temperature, so as to avoid PCB board scrap, increase the cost.

2. What is the maximum temperature resistance of PCB board?

In order to ensure the quality of finished PCB, reliability and adaptability tests are required. The temperature resistance test of PCB board is to prevent PCB board bursting, bubbling, delamination and other adverse reactions at too high temperature, leading to poor product quality or direct scrap, which is an issue that needs to be paid attention to. So PCB board temperature maximum how many degrees, how to do heat resistance test?

The temperature of PCB board is related to the temperature of its raw materials, solder paste and surface parts. Usually, the highest temperature resistance of PCB board is 300 degrees, 5-10 seconds; Over lead-free wave soldering temperature is about 260, over lead is about 240 degrees.

PCB board heat resistance test

1, first prepare PCB board production board, tin furnace.

Sample 5 pieces of 10*10cm base plate (or pressed plate, finished plate); "(Copper-containing substrate without bubbling stratification).

Substrate: more than 10cycle; Pressed plate: LOW CTE 150 10cycle and above; HTg material more than 10cycle; Normal material at least 5 cycles.

Finished plate: LOW CTE 150 5cycle or above; HTg material more than 5cycle; Normal material at least 3 cycles.

2. Set the temperature of tin furnace at 288+/-5 degrees, and adopt contact temperature measurement and correction.

3, soak with a soft brush for flux, apply to the board face, reoccupy crucible  pliers buccal test board into tin stove, timing out 10 SEC after cooling to room temperature, visual presence of foaming board appear, this is 1 cycle.

4. If the problem of bubbling and bursting plate is found visually, immediately stop leaching tin and analyze the initiation point f/m. If there is no problem, continue the cycle until the bursting plate, with 20 times as the end point.

5. It is necessary to slice and analyze the bubbling place, understand the source of detonation point, and take pictures.

PCB board in overheating temperature will produce some bad problems, so for different materials of PCB board temperature resistance, it is necessary to understand in detail, do not exceed the maximum limit temperature, so as to avoid PCB board scrap, increase the cost.