Electromagnetic compatibility (EMC) concerns both the emission and sensitivity of a system. If interference cannot be completely eliminated, it should be minimized. A DSP system is electromagnetic compatible if it meets the following three conditions.
This paper introduces various techniques of the three types of interconnect design, including device installation methods, wiring isolation and measures to reduce lead inductance.
With the development of the electronic industry, the integration degree of electronic components is getting higher and higher, and the volume is getting smaller and smaller, and the BGA type package is widely used.
The production process of high frequency and high speed PCB board is basically the same as that of ordinary PCB board.
The reasonable selection of printed board size can make full use of the intermediate layer to set the shield, realize the nearby grounding better, reduce the parasitic inductance and shorten the transmission length of the signal.
A standard PCB looks something like this. Bare Board (with no parts attached) is also often referred to as a "Printed Wiring Board (PWB)".
The development level of printed circuit board industry can reflect the development speed and technical level of electronic industry in a country or region to some extent.
With the "copper plating" process put into use, our company's various production lines have been established, through the introduction of production technical personnel, increase the training and education of production line staff, to ensure the...
The choice of surface treatment process mainly depends on the type of final assembly components; The surface treatment process will affect the production, assembly and final use of PCB board.
communication backplane, automotive board and other fields is relatively slow, while the HDI board, packaging board and soft board applied in high-end mobile phones, laptops and other "thin and short" electronic products will maintain rapid grow...
scheme selection, circuit design, circuit board design, structure design, component selection, production process, etc
There are many PCB surface treatment processes, the common ones are hot air leveling, organic coating, electroless nickel plating, gold dipping, silver dipping and tin dipping.
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