Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13923401642Mon.-Sat.08:00-20:00
Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)
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Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.