Yes! You can rely on our BGA rework services to ensure optimum performance.
Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)
BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.
We have our own PCB and SMT processing factory, which can meet customers' one-stop service from design to proofing
Design data output: PCB source files, Gerber files, assembly files, stencil files, structural files, etc.