Name: Car driving recorder HDI PCB
Tier: 1+6+1
Sheet: EM825
Plate thickness: 1.6mm
Size: 242mm*165mm
Minimum blind hole: 0.1mm
Min Buried Via: 0.25mm
Minimum line width: 0.088mm
Minimum line spacing: 0.087mm
Surface Treatment: Immersion Gold
Outline tolerance: +/-0.1mm
Special requirements: L3-L6 resin plug holes
10-layer 1-stage HDI communication PCB
Name: 10-layer 1-stage HDI communication PCB
Layers: 1+8+1
Sheet: FR4 Tg170
Plate thickness: 1.2mm
Panel size: 110.8*94.8mm/4
Outer copper thickness: 35μm
Inner layer copper thickness: 18μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.20mm
Line width and line spacing: 2.5/2.2mil
Surface Treatment: Immersion Gold 2μ''+OSP
Application field: communication
6L 2+N+2 HDI Communication PCB
Name: 6L 2+N+2 HDI Communication PCB
Model : 2+N+2 HDI Communication PCB
Layers : 6Layers
Material: IT150
Construction : 2+2+2 HDI PCB
Finished Thickness: 0.8mm
Copper Thickness: 0.5OZ
Color : Green/White
Surface Treatment: Immersion Gold+OSP
Min Trace / Space: 3mil/3mil
Min Hole: Laser Hole 0.1mm
Application : Communication HDI PCB
Name: 6L 2+N+2 HDI WiFi Module PCB
Layers : 6Layers
Material:FR4 Tg170
Construction : 2+2+2 HDI PCB
Finished Thickness: 0.8mm
Copper Thickness: 1OZ
Color : Black/White
Surface Treatment: Immersion Gold+OSP
Min Trace / Space: 3mil/3mil
Min Hole: Laser Hole 0.1mm
Application : WiFi module PCB
Name: 6-layer 1-stage HDI PCB
Layers: 1+4+1
Sheet: FR4 Tg150
Plate thickness: 1.6mm
Panel size 105*95mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 30μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.20mm
Line width line spacing: 3/3mil
Surface Treatment: Immersion Gold 2μ''+OSP
Application field: industrial control
Name: 10-layer 3-stage HDI PCB
Layers: 3+4+3
Sheet: FR4 Tg170
Plate thickness: 1.2mm
Panel size: 126*118mm/4
Outer copper thickness: 35μm
Inner layer copper thickness: 18μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.25mm
Line width and spacing: 2.8/3.2mil
Surface Treatment: Immersion Gold 2μ''+OSP
Name: 10-layer 1-level HDI pcb
Layers: 1+8+1
Sheet: FR4 Tg170
Plate thickness: 1.6mm
Panel size: 121.6*95mm/2
Outer copper thickness: 1OZ
Inner layer copper thickness: 1OZ
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.25mm
Line width line spacing: 3/2.7mil
Surface Treatment: Immersion Gold 2μ''
Blind hole process: hole filling and electroplating
Name: 2+N+2 HDI ITEQ PCB 6L PCB
Model : 6L 2+N+2 HDI PCB
Material: ITEQ IT150
Layer: 6L 2+N+2 HDI
Color: Black/White
Finished Thickness: 1.0m
Copper Thickness: inner1OZ outer0.5OZ
Surface Treatment :Immersion Gold +OSP
Min Trace / Space: 2.5mil/2.5mil
Min Hole: Mechanical hole 0.2mm, Laser Hole 0.1mm
Application: Communication pcb
Communication equipment 2-stage HDI PCB board
Name: Automotive communication second-order HDI board
Plate: S1000-2M
Layers: 14L
Material: ISOLA
Plate thickness: 1.6±0.16mm
Minimum aperture laser hole: 0.10mm
Mechanical hole: 0.20mm
Minimum track/spacing: 75/75um
Minimum plate thickness and porosity: 8:1
Special process: 2 laser drilling, 3 pressing, second-order HDI board
Use: vehicle communication
Twelve-layer second-order board
name: Twelve-layer second-order board
Plate: FR4
Layers: 12L
Material: ISOLA
Plate Thickness: 2.0mm
Copper thickness of inner and outer layers: 1oz
Minimum hole diameter: 0.1mm
Surface Treatment: Immersion Gold
Line width: 0.1mm
Line distance: 0.1mm
BGA pad: 0.15mm
Special craftsmanship: second stage
Use: consumer electronics
- PCB Manufacturing Equipment
- HDI PCB Capability
HDI (High Density Interconnect) PCB Process Capability | ||
Item | batch | Template |
layers | 4-16 Layers | 4-24 Layers |
Plate thickness range | 0.6-3.2mm | 0.4-6.0mm |
highest order | 4+N+4 | Any layer innterconnected |
Minimum laser hole | 4mil (0.1mm) | 3mil (0.075mm) |
Laser process | CO2 Laser Machine | CO2 Laser Machine |
Tg value | 140/150/170°C | 140/150/170°C |
hole copper | 12-18μm | 12-18μm |
Impedance tolerance | +/-10% | +/-7% |
interlayer alignment | +/-3mil | +/-2mil |
Solder Mask Alignment | +/-2mil | +/-1mil |
Minimum line width/line spacing | 2.5/2.5mil | 2.0/2.0mil |
Smallest grommet | 2.5mil | 2.5mil |
Minimum through hole | 8mil (0.2mm) | 6mil(0.15mm) |
smallest micropore | 4.0mil | 3.0mil |
Minimum media thickness | 3.0mil | 2.0mil |
Minimum pad | 12mil | 10mil |
Micropore Aperture Aspect Ratio | 1:1 | 1:2:1 |
We have robust quality inspection procedures, and most importantly, a large number of satisfied customers is the greatest testimony to our success.
Yes, we provide high-density PCB manufacturing services, if you have any needs, please contact sales@kingfordpcb.com