4-layer HDI switch circuit board design
Name: 4-layer HDI switch circuit board design
Sheet: IT180, F4BM, FR4, FR1-4, etc.
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Surface treatment: rosin spray tin electric gold, anti-oxidation, chemical gold, carbon oil
Service: Provide OEM service
4-layer HDI PCB is widely used in:
Telecom module
wireless module
LED display module
HDI PCB (1+N+1): This is the simplest HDI PCB layout design structure, suitable for BGAs with fewer I/Os. It features fine lines, micro vias, and registration technology capable of 0.4mm ball pitch for excellent mounting stability and reliability, and may contain copper-filled vias. It is qualified material and finish for lead free process
Name: 4-layer HDI switch circuit board design
Sheet: IT180, F4BM, FR4, FR1-4, etc.
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Surface treatment: rosin spray tin electric gold, anti-oxidation, chemical gold, carbon oil
Service: Provide OEM service
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