Six-layer HDI PCBA design and production

Name: TG180 High Density Interconnector PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

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Product Details Data Sheet

This is a 6-layer HDI rigid flex PCB with blind and buried vias. Made of the most common rigid insulating materials, FR4 and DuPont polyimide, with good flexural properties. In addition, its 0.6mm thick rigid area gives the board good strength. All laminates are sourced from authorized dealers under XPCB inspection.

With the ENIG finish, this rigid flex circuit has the advantages of excellent surface flatness, good oxidation resistance and suitability for movable contacts.