8-layer second-order HDI PCBA design
Name: 8-layer second-order HDI PCBA design
Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
For BGAs with smaller ball pitch and higher I/O count
Increase routing density in complex designs
Sheet Capability
Lower Dk/Df material for better signal transmission performance
copper filled vias
Applications: Mobile phones, PDAs, UMPCs, portable game consoles, digital cameras, camcorders
Name: 8-layer second-order HDI PCBA design
Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
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