6-layer 1-stage HDI PCB
Name: 6-layer 1-stage HDI PCB
Layers: 1+4+1
Sheet: FR4 Tg150
Plate thickness: 1.6mm
Panel size 105*95mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 30μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.20mm
Line width line spacing: 3/3mil
Surface Treatment: Immersion Gold 2μ''+OSP
Application field: industrial control
This is a 6-layer HDI rigid flex PCB with blind and buried vias. Made of the most common rigid insulating materials, FR4 and DuPont polyimide, with good flexural properties. In addition, its 0.6 mm thick rigid area gives the board good strength. All laminates are sourced from authorized dealers under XPCB inspection.
With the ENIG finish, this rigid flex circuit has the advantages of excellent surface flatness, good oxidation resistance and suitability for movable contacts.
Name: 6-layer 1-stage HDI PCB
Layers: 1+4+1
Sheet: FR4 Tg150
Plate thickness: 1.6mm
Panel size 105*95mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 30μm
Minimum through hole: 0.20mm
Minimum blind hole: 0.10mm
Minimum BGA: 0.20mm
Line width line spacing: 3/3mil
Surface Treatment: Immersion Gold 2μ''+OSP
Application field: industrial control
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