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HDI PCB
HDI PCB
10-layer 1-stage HDI communication PCB

10-layer 1-stage HDI communication PCB

Name: 10-layer 1-stage HDI communication PCB

Layers: 1+8+1

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 110.8*94.8mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.20mm

Line width and line spacing: 2.5/2.2mil

Surface Treatment: Immersion Gold 2μ''+OSP

Application field: communication

Product Details Data Sheet

Technical features:

50 Ω Antenna, 90Ω & 100Ω Differential Impedance

application:

Cell Phones, Tablets, Ultrabooks, E-Readers, MP3 Players, GPS, Portable Game Consoles, DSCs, Cameras, LCD TVs, POS Terminals


HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices. High-density PCBs are often found in mobile phones, touch screen devices, laptops, digital cameras, and 4G network communications. HDI PCB also plays an important role in medical equipment as well as various electronic aircraft components. The possibilities for high-density interconnect PCB technology seem almost limitless.

Name: 10-layer 1-stage HDI communication PCB

Layers: 1+8+1

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 110.8*94.8mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.20mm

Line width and line spacing: 2.5/2.2mil

Surface Treatment: Immersion Gold 2μ''+OSP

Application field: communication

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.