Medical control motherboard PCB design
Name: Medical control motherboard PCB design
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
Network equipment circuit board design
Name: Network equipment circuit board design
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
Automotive motherboard PCB design
Name: Automotive motherboard PCB design
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
Embedded motherboard PCB design
Name: Embedded motherboard PCB design
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
Name: 4-layer sphygmomanometer PCB design
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
PCB design of fast charging power bank
Name: PCB design of fast charging power bank
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
GPS Base Station PCB/PCBA Design
Name: GPS Base Station PCB/PCBA Design
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
Name: RF equipment PCB/PCBA design
Designable layers: 1-32 layers
Minimum line width and line spacing: 3mil
Minimum laser aperture: 4mil
Minimum mechanical aperture: 8mil
Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)
Peel strength: 1.25N/mm
Minimum punching hole diameter: single side: 0.9mm/35mil
Minimum hole diameter: 0.25mm/10mil
Aperture tolerance: ≤φ0.8mm±0.05mm
Hole tolerance: ±0.05mm
Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil
Hole resistance: double-sided/multi-layer: ≤300цΩ
Minimum line width: 0.127mm/5mil
Minimum pitch: 0.127mm/5mil
Screen printing color: black, white, red, green, etc.
Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP
Service: Provide OEM service
Certificate: ISO9001.ROSH.UL
- PCB Design Capabilities
PCB Design&Layout Capabilities | |||
Min.trace width: | 2.5mil | Min.trace spacing | 2.5mil |
Min.Vias: | 6mil(4mil laser drilling) | Max.layer | 48L |
Min.BGA spacing | 0.35mm | Max.BGA Pin | 3600pin |
Max.high-speed signal | 40 GBPS | Fastest delivery time | 6 Hours/ Item |
HDI Highest layer | 22 L | HDI Highest layer | 14 L any layer HDI |
PCB Design&Layout lead time | |||
Number of pins on the board | 0-1000 | Design lead time (working days) | 3-5 days |
2000-3000 | 5-8 days | ||
4000-5000 | 8-12 days | ||
6000-7000 | 12-15 days | ||
8000-9000 | 15-18 days | ||
10000-12000 | 18-20 days | ||
13000-15000 | 20-22 days | ||
16000-18000 | 22-25 days | ||
18000-20000 | 25-30 days | ||
Ultimate delivery capacity | 10000Pin/7 days | ||
PS: The above delivery date is the regular delivery date, and the accurate design delivery date needs to be comprehensively evaluated according to the number of components, difficulty, layers and other factors of the circuit board! |
We have robust quality inspection procedures. Most importantly, a large number of satisfied customers is the greatest testimony to our success.