12-layer automotive high-speed backplane design

Name: 12-layer automotive high-speed backplane design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

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Product Details Data Sheet

feature

 Small size provides significant space savings

 Modular design provides application flexibility

 High performance system

 High-density backplane system - up to 84 differential pairs per linear inch

 1.80 mm post spacing

3 Pair, 4 Pair and 6 Pair Designs

 4, 6 or 8 columns

 12 - 48 pairs

 Multiple signal/ground pin classification options

 Provides integrated power, boot, keying and sidewalls

 85 Ω and 100 Ω options

Three-level sorting supports hot swap

 Cost-effective design for low-speed applications