High TG High Frequency Rogers 5880 PCB
Name: High TG High Frequency Rogers 5880 PCB
Substrate: FR4
Copper Thickness: 1 oz
Plate thickness: 1.6mm
minute. Hole size: 0.1mm
minute. Line width: 0.1mm
minute. Line spacing: 0.1mm
Surface Treatment: Immersion Gold
Board size: customized
Silkscreen: White/Black
Solder Mask: Green
Impedance Control Tolerance: 5%
PCB Standard: IPC-A-610 D
Certification: ISO-9001, ISO-1004, ROHS
Material: FR4 CEM1 CEM3 High TG
Minimum thickness: 10 microns
Layers: 1-28
TG180, TG170 communication PCB manufacturing
Name: High Tg cell phone manufacturing electronic pcb
Type: communication pcba
Copper Thickness: 2 oz
Product name: PCBA board assembly
Laminate: FR-4, halogen free, high TG, etc.
Surface treatment: OSP, HASL, Immersion Gold, Immersion Tin, etc.
Plate thickness: 0.3-3.5mm
Solder mask: green, black, blue, red, white, etc.
Blind and buried vias: yes
Independent control tolerance: ±10%
High Tg Single Sided Rogers 4003 pcb
Name: High Tg Single Sided Rogers 4003 pcb
Type: High Frequency Circuit Board
Substrate: Rogers/Taconic/Aron
Copper Thickness: 1 oz
Plate thickness: 1.6mm
minute. Hole size: 0.2mm
minute. Line width: 3 million
minute. Line spacing: 3 million
Board size: 300*600mm, or can be customized
Product Name: High Frequency PCB Board
Layers: 1~20 layers
Testing Service: 100% AOI Testing
Certificate: ISO9001/Iso14001/CE/ROHS
Application: Electronics
High Tg Board High Frequency Rogers 5880 PCB
Name: High Tg Board High Frequency Rogers 5880 PCB
Substrate: FR-4
Copper Thickness: 1 oz
Plate Thickness: 1.6mm, 1.6mm
minute. Hole size: 0.1mm
minute. Line width: 3 million
minute. Line spacing: 3 million
Surface treatment: spray tin lead-free, spray tin lead-free
Board Size: Green Soldermask, White Silkscreen
Minimum aperture: 0.25mm
Minimum line spacing: 0.003"
Color: Green or as your request
Material: FR-4
Layers: 2 layers
FR4 High TG Multilayer HDI PCB
Name: FR4 High TG Multilayer HDI PCB
Type: Medical PCBA, PCB Assembly/PCBA
Copper Thickness: 1 oz, 0.5-4 oz, regular 1 oz
Product Name: Printed Circuit Board
Material: FR4/Aluminum/Ceramic CEM1 etc.
Layers: 1-60 layers
Shapes: Rectangle, Circle, Slot, Cutout, Complex, Irregular or Custom.
Plate thickness: 0.2-4mm, conventional 1.6mm
Solder Mask: White.Black.Yellow.Green.Red.Blue or custom.
Name: Fr4 High Tg Multilayer PCB
Model: customized
Substrate: FR4, FR1-4, FR4, FR1-4
Copper Thickness: 0.5oz, 1oz, 2oz, 3oz,4oz, 0.5oz, 1oz, 2oz, 3oz,4oz
Thickness: 0.6MM, 0.4mm-3.2mm, 0.6MM, 0.4mm-3.2mm
Surface treatment: lead-free spray tin, spray tin lead-free
Layers: 1-58 layers
Certificate: ISO9001/RoHS/CE
Solder mask color: green, white
Name: FR4 TG 180 PCB
Base material: FR4, aluminum
Copper Thickness: 0.5-4OZ / 1 Oz / 2Oz or customized
Plate thickness: 0.2~6mm
minute. Hole size: 0.15mm
minute. Line width: 0.015mm
minute. Line spacing: 0.015mm
Surface treatment: tin spray, immersion gold, flash gold, silver plating, OSP
Application: Industrial Control, Medical, Security, IoT Gateway, Internet
Solder mask color: green, red, black (according to your requirements)
Silk screen color: white, black (according to your request)
Layers: 1-64
Certificate: RoHS/ISO9001/TS16949/ISO14001/ISO13485
Packaging: vacuum, anti-static, ESD
8L Multilayer HDI High Tg 180 PCB
Name: 8L Multilayer HDI High Tg 180 pcb
Copper Thickness: 1 oz
Plate Thickness: 1.6mm, 1.6mm
minute. Hole size: 0.1mm
minute. Line width: 3 million
minute. Line spacing: 3 million
Surface treatment: spray tin lead-free, spray tin lead-free
Minimum line spacing: 0.003"
Color: Green or as your request
Material: FR-4
Layers: 2 layers
Packing: vacuum packing
- PCB Manufacturing Equipment
- PCB manufacturing capability
Standard PCB Production Capability | |
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 1 - 32layers |
Order Quantity | 1pcs - 10,000,000 pcs |
Build Time | 2days - 5weeks (Expedited Service) |
Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
Board Size | Min 6*6mm | Max 600*700mm |
Board size tolerance | ±0.1mm - ±0.3mm |
Board Thickness | 0.4mm - 3.2mm |
Board Thickness Tolerance | ±0.1mm - ±10% |
Copper Weight | 0.5oz - 6.0oz |
Inner Layer Copper Weight | 0.5oz - 2.0oz |
Copper Thickness Tolerance | +0μm +20μm |
Min Tracing/Spacing | 3mil/3mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Blue, Black, Red, Yellow |
Surface Finish | HASL - Hot Air Solder Leveling |
Lead Free HASL - RoHS | |
ENIG - Electroless Nickle/Immersion Gold - RoHS | |
ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS | |
Immersion Silver - RoHS | |
Immersion Tin - RoHS | |
OSP -Organic Solderability Preservatives - RoHS | |
Min Annular Ring | 3mil |
Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
Min Width of Cutout (NPTH) | 0.8mm |
NPTH Hole Size Tolerance | ±.002" (±0.05mm) |
Min Width of Slot Hole (PTH) | 0.6mm |
PTH Hole Size Tolerance | ±.003" (±0.08mm) - ±4mil |
Surface/Hole Plating Thickness | 20μm - 30μm |
SM Tolerance (LPI) | .003" (0.075mm) |
Aspect Ratio | 1.10 (hole size: board thickness) |
Test | 10V - 250V, flying probe or testing fixture |
Impedance tolerance | ±5% - ±10% |
SMD Pitch | 0.2mm(8mil) |
BGA Pitch | 0.2mm(8mil) |
Chamfer of Gold Fingers | 20, 30, 45, 60 |
Other Techniques | Gold fingers |
Blind and Buried Holes | |
peelable solder mask | |
Edge plating | |
Carbon Mask | |
Kapton tape | |
Countersink/counterbore hole | |
Half-cut/Castellated hole | |
Press fit hole | |
Via tented/covered with resin | |
Via plugged/filled with resin | |
Via in pad | |
Electrical Test |