Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
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- PCB Design Capabilities
PCB Design&Layout Capabilities | |||
Min.trace width: | 2.5mil | Min.trace spacing | 2.5mil |
Min.Vias: | 6mil(4mil laser drilling) | Max.layer | 48L |
Min.BGA spacing | 0.35mm | Max.BGA Pin | 3600pin |
Max.high-speed signal | 40 GBPS | Fastest delivery time | 6 Hours/ Item |
HDI Highest layer | 22 L | HDI Highest layer | 14 L any layer HDI |
PCB Design&Layout lead time | |||
Number of pins on the board | 0-1000 | Design lead time (working days) | 3-5 days |
2000-3000 | 5-8 days | ||
4000-5000 | 8-12 days | ||
6000-7000 | 12-15 days | ||
8000-9000 | 15-18 days | ||
10000-12000 | 18-20 days | ||
13000-15000 | 20-22 days | ||
16000-18000 | 22-25 days | ||
18000-20000 | 25-30 days | ||
Ultimate delivery capacity | 10000Pin/7 days | ||
PS: The above delivery date is the regular delivery date, and the accurate design delivery date needs to be comprehensively evaluated according to the number of components, difficulty, layers and other factors of the circuit board! |
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High Voltage PCB Design FAQ
The principle of an amplifier is to produce an output signal that is a replica of the input signal with increased amplitude.
High-voltage applications are spacecraft and other space equipment, high-altitude aircraft, high-tech lasers, and particle collider power supplies.
Some of the substrate materials used in high voltage PCBs include: BT epoxy, phenolic cured rigid laminate, high voltage Teflon (HVPF).
Maintain clearance between high voltage drop traces. Avoid any sharp turns and edges as they can act as areas for concentrated electric fields. Avoid running very high voltage traces on the inner layers of the board.
Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.