Production Quality Requirements for Circuit Boards of Shenzhen Circuit Board Factory

Production Quality Requirements for Circuit Boards of Shenzhen Circuit Board Factory

Circuit board manufacturers, circuit board designers and PCBA manufacturers explain the quality requirements of circuit boards produced by Shenzhen Circuit Board Factory

PCBA processing is to connect various electronic components on PCB board through surface mount (SMT), plug-in (DIP) and other electronic assemblies. PCBA process flow mainly includes SMT, AOI, DIP, FCT testing and other processes. Due to the size difference of electronic components, there will be different processes and requirements in assembly and insertion. The assembly density of PCBA is relatively high, and the small size and light weight of electronic products also have certain changes and requirements in mounting. The reliability, seismic resistance and excellent weldability of the products have high requirements for the hardware and software facilities of PCBA processing.

Printed circuit board is a special electronic accessory product. One customer, one model, and one board are processed according to the customer's special documents. It is not universal. When a batch of printed boards is rejected by the ordering customer, BEU can only be scrapped, and no other customer will accept it However, although the circuit patterns and structural dimensions of various printed boards are different, they also have commonalities, which are their basic requirements. Today, I want to share with you the quality requirements of Shenzhen Circuit Board Factory for circuit boards.

Production Quality Requirements for Circuit Boards of Shenzhen Circuit Board Factory

First, appearance requirements

The first impression of any product (article) is its appearance. Appearance functions in two aspects: usability and artistry. The printed board shall also give people the feeling of exquisite artwork without affecting the use. Appearance includes plate edge, surface conductor, solder mask, marking layer, plating/coating.

Production Quality Requirements for Circuit Boards of Shenzhen Circuit Board Factory

The contents of appearance inspection include:

(1) The surface is free of contamination, inclusion, fingerprints and oxidation to prevent affecting solderability and insulation.

(2) The plate edge shall be smooth and clean without concave convex or burr, so as not to affect the assembly size and insulation.

(3) The conductor shall be uniform without corrosion, notch and residual copper, so as to avoid affecting the electrical performance.

(4) The color of solder mask pattern shall be consistent, without peeling, missing printing, deviation or oil leakage, so as to prevent affecting welding.

(5) The marking symbols shall be clear and shall not be pasted and readable to prevent affecting assembly and maintenance.

(6) There shall be no scratches on the surface to avoid affecting the welding assembly and electrical performance.

(7) There shall be no blistering or delamination between conductors or insulation layers, especially multilayer plates, to avoid affecting mechanical and electrical properties.

In addition to these requirements, our Shenzhen PCB Factory has other requirements in terms of quality:

(1) Dimensional requirements

(2) Electrical performance requirements

(3) Mechanical performance requirements

(4) Environmental resistance and other performance requirements

Circuit board manufacturers, circuit board designers and PCBA manufacturers explain the quality requirements of circuit boards produced by Shenzhen Circuit Board Factory.