Explanation of surface roughness terms: what are BOM, DIP, SMT, SMD

Explanation of surface roughness terms: what are BOM, DIP, SMT, SMD
BOM Company
This bill of exchange, bill of exchange material (BOM) is a document describing the product structure in the data table or mat is a bill of exchange material This surface mount processing BOM company contains the material name, quantity, and placement location number BOM company is an important basis for machine programming and integrated quality control validation
Dip angle package, also known as dual in-line package technology, refers to integrated circuit chips packaged in dual in-line form. Most small and medium-sized integrated circuits use this packaging form, and the number of pins usually does not exceed 100. The CPU chip packaged with tilt angle and tilt angle has two rows of pins, which need to be inserted into the chip slot with tilt angle and tilt angle structure.
Surface mount
Circuit board

Surface mount technology, called "SurfaceMountTechnology" in English, or surface mount for short, is a circuit assembly technology used to connect and solder surface mount components to designated locations on the surface of printed circuit boards Specifically, first coat solder paste on the printed circuit board, then accurately place the surface mount components on the solder pad coated with solder paste, and then heat the printed circuit board until the solder paste melts and cools down After that, the interconnection between components and PCB is realized In the 1980s, SMT production technology became more and more perfect Mass production of components used in surface mount technology has led to a sharp drop in prices All kinds of equipment with good technical performance and low price have appeared one after another The surface mounting volume of assembled electronic products is small It has the advantages of good efficiency, complete functions, low price and surface mounting. As a new generation of electronic assembly technology, it is widely used in aviation PCBA, aviation PCB production, communication PCB production, computer PCB production, medical electronic PCB production, automobile PCB production, and electronic product surface roughness patches in various fields, such as office automation PCB production and household appliance PCB production Surface mount features, high assembly density, small volume and light weight of electronic products The volume and weight of the patch assembly is only 1/10% of that of the traditional one Generally, after surface mounting, the number of electronic products is reduced by 40% to 60%, and the weight is reduced 60%~80%.
Patch
SMD surface mounted equipment (surface mounted equipment), "In the initial stage of electronic circuit board production, through-hole assembly was completely completed manually. After the first batch of automated machines were introduced, they could place some simple pin components, but complex components still needed to be placed with wave soldering manually. Surface mount components were introduced about 20 years ago, and created a new era. From passive e components to active components and integrated circuits, they eventually became surface mount devices (SMDs) , which can be assembled by picking and placing equipment. For a long time, it was believed that all lead components could eventually be packaged in a chip.