Common ceramic substrate

species

According to the data

1. Alumina circuit board

Alumina substrate is the electronic light industry in the most rare substrate information, because of the machine, thermal, electrical function is absolutely in large minority of the rest of the oxide ceramics, high strength and chemical stability, and the origin of rich ingredients, practical in all kinds of skills to build and do not have the same shape. Sleeton iron oxide substrate was once able to stop 3D customization.

2. Beryllium oxide circuit board

It has a higher thermal conductivity than nonmetallic aluminum, which is used in places requiring high temperature conductivity. However, it increases rapidly after measuring above 300℃, mainly because its toxicity limits its stagnation.

Beryllium oxide ceramics are ceramics in which beryllium oxide is a secondary factor. Mainly used as a large range of integrated subgrade plate, high power gas laser tube, junction transistor radiator shell, microwave input window and neutron accelerator data.

Pure beryllium oxide (BeO) belongs to the cubic system with a density of 3.03g/cm3. Melting point 2570℃, is a very high conductivity, and copper pure aluminum is the same, conductivity coefficient λ 200-250W/(m.K), there is a good tax shock resistance. Its dielectric constant is 6 ~ 7 (0.1MHz). The dielectric consumption Angle tangent value is about 4×10-4(0.1GHz). The greatest disadvantage is that the powder is highly toxic and makes healing of contact wounds difficult. Beryllium oxide powder was used as the raw material, and iron oxide and other ingredients were sintered at low temperature. Making such ceramics requires excellent protective measures. Beryllium oxide in a low temperature medium containing water vapor, evaporation will improve, starting at 1000℃ evaporation, and as measured by decreasing evaporation increases, this brings difficulties to consumption, some countries have no consumption. But the product function is excellent, although the price is higher, there is still an equal large demand.

3. Aluminum nitride circuit board

AlN has two very important functions that are not worth paying attention to: at one time it is high thermal conductivity, and at one time it is shrinkage coefficient of matching with Si. The deficiency is that even the very thin oxide layer will react to the thermal conductivity, as long as the data and process stop strict control ability to create a better divergent AlN substrate. AlN consumption skills international like Sleetong as a large range of consumption is less, absolutely in Al2O3, AlN price is absolutely much higher, a small bottleneck is also limited to its stagnation. As the economy moves up and skills advance, the bottleneck disappears.

Analysis on the reason, can know, iron oxide ceramics because of the comparative preferential analysis function, in the microelectronics, power electronics, mixed microelectronics, power module and other mammary or in the dominant position and is used in a small amount.

AlN can be stable up to 2200℃. The strength of room temperature is high, and the strength drops slowly with the decrease of measurement. Good electrical conductivity, small thermal shrinkage coefficient, is an excellent heat-resistant charge data. Anti-melting non-metallic corrosion power is strong, casting pure iron, aluminum or aluminum alloy crucible data. Aluminum nitride or electric non-conductor, dielectric function is excellent, used as an electrical component is also very promising. Gallium arsenide is an aluminum-nitride insulating layer that protects it from ion implantation during annealing. Aluminum nitride is also the catalyst for the change from hexagonal boron nitride to cubic boron nitride. The reaction with water rapids at room temperature. Aluminum powder can be decomposed by 800~1000℃ in ammonia or nitrogen atmosphere, and the product is red to gray blue powder. Or by Al2O3-C-N2 system is reaction decomposition at 1600~1750℃, the product is gray red powder. Or aluminum chloride and ammonia through the same process. The insulation layer can be decomposed by AlCl3-NH3 system by gas phase stacking method.

4. Silicon nitride circuit board

The flexural strength of the new ceramic substrate made of silicon nitride is higher than that of the substrate made of Al2O3 and AlN.

The fracture toughness of Si3N4 surpasses that of zirconia-doped ceramics.

In the past, the reliability of copper-covered ceramic substrates used in power modules has been subject to the low flexural strength of ceramics, which then increases the thermal repetition power. About those that combine extreme heat and machine stress. Similar to hybrid energy buses and automatic buses (HEV/EV), the rare ceramic substrate is not the best choice. The thermal shrinkage coefficient of the substrate (ceramic) and superconductor (copper) is very different, which will stress the bonding zone during the thermal repetition period, thereby increasing the robustness. The curamik? Introduced by Rogers at the previous PCIM exhibition Series silicon nitride (Si3N4) ceramic substrate, will make the wind electronic module life extension of 10 times.