SMT patch processing need to pay attention to several standard issues

With the continuous development of modern science and technology, SMT chip processing technology is also more and more widely used in various fields. However, in the process of SMT patch processing, there are some standard problems that need our special attention. These problems may have an impact on processing efficiency and quality, so it is necessary to strictly comply with relevant standards during operation. Next, Shenzhen SMT processing plant - Honglijie Electronics for everyone to introduce one by one. 20 (1) https://www.kingfordpcb.com/yuan.php?time=1685694568

The first point: the size error problem

In the SMT patch processing process, the size error is a very important standard problem. Because SMT components of different sizes need to match different process parameters. If the process parameters are not accurate, it will lead to errors in the precision of the components. Therefore, in the process of SMT patch processing, the size of each component must be accurately measured to avoid errors.

Second point: component offset problem

Component offset is also a standard problem that needs to be paid attention to when SMT is processed. Because the component offset will make the entire circuit board wiring error, resulting in the electrical performance of the circuit board problems. Therefore, in the operation process, it is necessary to ensure that the position of each component is correct, and maintain a certain distance from the previously arranged components to avoid component deviation.

Third point: temperature control

In the SMT patch processing process, temperature control is also an important standard problem. Because the heating temperature is not correct, it will lead to the component welding is not strong, thus affecting the service life of the circuit board. Therefore, when SMT patch processing is carried out, the temperature should be controlled during the operation to avoid too high or too low temperature to ensure that the components can be completely welded.

Fourth point: PCB surface treatment problem

When SMT patch processing is carried out, the treatment of the PCB surface is also a standard issue that needs attention. Because the surface of the PCB board is not completely treated, the contact area between the component and the PCB board will become smaller, affecting the welding quality. Therefore, in the PCB surface treatment process, it is necessary to pay attention to cleanliness, avoid surface pollution, oxidation and corrosion problems, and ensure that the PCB surface treatment is complete.

These are several standard issues that need to be noted in SMT chip processing. When SMT chip processing is carried out, these standards need to be strictly followed to ensure the stability and reliability of processing quality. In addition, we also need to seriously learn and master the relevant knowledge of SMT chip processing technology, so as to continuously improve our comprehensive processing capabilities and levels.