Six methods to prevent PCBA plate bending and warping in the welding furnace

In recent years, the rapid development of the electronic manufacturing industry, more and more people began to pay attention to PCB design and manufacturing problems. Among them, PCBA plate is prone to plate bending and plate warping after returning to the welding furnace, which brings a lot of troubles to manufacturers. In order to solve this problem, we must take some measures to reduce the probability of bending and warping. In this article, we will share six effective ways to help you prevent PCBA plate bending and warping when it goes back to the welding furnace.

Method of bending and warping PCBA plate when passing through the welding furnace

First: the correct selection of PCB materials.

When starting manufacturing, the organization or company needs to choose a high-quality PCB material. You can ensure that the PCB materials you are using are of high quality by talking to your suppliers. The thermal expansion coefficient of PCB material is very important, if the selected material thermal expansion coefficient does not match, it will lead to plate bending and plate warping. Therefore, the use of PCB materials with matching thermal expansion coefficient can reduce the probability of bending and warping of the plate during the welding process.

Second: Determine the correct PCB thickness.

As with PCB materials, the correct selection of PCB thickness is also very important. If the PCB thickness is too thin, it may lead to bending and warping of the board. On the contrary, if the PCB thickness is too thick, it will lead to poor welding and increase its weight and cost. When determining the PCB thickness, the PCB material and welding process must be considered, and determining the correct PCB thickness can help reduce the probability of bending and warping the board.

Third: Adopt appropriate fixation methods.

In the manufacturing process of PCBA, the fixing method is also one of the reasons for the warping of the plate. In the processing process, the PCB is easy to move horizontally, and the movement will lead to deep damage such as plate bending and plate warping caused by PCB welding. Therefore, in the PCB manufacturing process, the correct use of fixed clamping, suction or magnetic suction mode and other fixed methods can reduce the probability of PCB board bending and board warping.

Fourth: reasonable rise and fall temperature and rise and fall rate.

The rise and fall temperature and the rise and fall rate are also factors that affect PCB board bending and board warping. During the welding rise and fall process, the temperature changes dramatically and the speed is too fast, which may cause the PCB board to bend and warp. Therefore, we need to control the changes in temperature and speed during the lifting process and gradually lift to reduce the probability of bending and warping the plate.

Fifth: Correct layout and welding method. 26 (1) https://www.kingfordpcb.com/yuan.php

The layout and welding method are also one of the key factors to prevent the bending and warping of PCBA plate after passing through the welding furnace. For example, in a complex assembly process, welding must begin at both ends of the PCB to control the mismatch of the thermal expansion of the PCB. In addition, the correct welding method, such as manual welding or wave soldering, will also affect the probability of PCB bending and warping. When selecting the welding method, the selection must be made according to the PCB shape, thickness, material and other factors.

Sixth: Correct transportation and storage.

In the PCBA manufacturing process, the correct transportation and storage method is also one of the important factors to prevent the PCBA plate from bending and warping when it passes back to the welding furnace. During transportation and storage, the PCB board must be kept level and fixed to avoid the occurrence of board warping. In addition, we should avoid putting the PCB board in a high temperature and high humidity environment to avoid moisture and cracking of the PCB board. Therefore, the correct transportation and storage methods can reduce the probability of PCB board bending and board warping.

In summary, the above methods are not isolated, but should be viewed as a whole PCBA manufacturing, there may be more details to consider. We hope that you can understand and take appropriate measures to reduce the probability of bending and warping of PCBA plates when passing through the welding furnace.