The difference between solder paste net and red glue net for SMT patch processing

In SMT patch processing, solder paste net and red glue net are two commonly used items. Solder paste mesh is used for solder paste on the printed circuit board, and red glue mesh is used for glue on the printed circuit board. What's the difference between these two items?

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1. Appearance of solder paste net and red glue net

There are some obvious differences between solder paste net and red glue net in appearance. Solder paste mesh is usually harder than red glue mesh. This is because the solder paste mesh needs better support to ensure print quality. On the other hand, red rubber mesh is usually softer than solder paste mesh. This is because the red glue mesh needs better contact with the circuit board to ensure that the glue can be evenly coated.

2. Material of solder paste net and red glue net

Solder paste net and red glue net in the material is also very different. Solder paste mesh is usually made of stainless steel. This is because stainless steel has very good strength and corrosion resistance. In addition, the surface of stainless steel is smooth and will not affect the printing quality. Red rubber mesh, on the other hand, is usually made of mylar. This is because polyester film is soft and has good transparency and low temperature resistance. This material can ensure the uniform coating of red glue and help the processing personnel to better grasp their operation process.

3. Aperture of solder paste net and red glue net

The aperture of solder paste net and red glue net is also different. Solder paste mesh usually has a small aperture, usually between 20 and 30 microns. This is because the solder paste needs to be placed directly on the circuit board. The small aperture ensures that the solder paste is evenly distributed and the components on the board are connected more tightly. On the other hand, the aperture of the red rubber mesh is usually larger, usually 70 to 120 microns. This is because red glue needs to form a protective layer on the circuit board. The large aperture ensures that the glue is evenly spread and forms a strong protective layer.

4. Printing process of solder paste net and red glue net

Solder paste mesh and red glue mesh are also different in the printing process. Solder paste screens are usually printed using manual or automatic presses. During the printing process, the solder paste mesh is placed on the press, the solder paste is coated on the holes of the solder paste mesh, and then the solder paste is pressed onto the circuit board. This ensures a uniform distribution of the solder paste and a tight connection of the board components. Red rubber mesh, on the other hand, is usually printed using an automatic press. During the printing process, the red glue mesh is placed on the press, the glue is applied to the holes of the red glue mesh, and then pressed onto the circuit board to form a protective layer. The automatic press of the red glue mesh ensures that the glue is evenly coated and a strong protective layer is formed.

The difference between solder paste net and red glue net is very big. Solder paste mesh is usually harder than red glue mesh, made of stainless steel, has a smaller aperture, and is printed using a manual or automatic press. Red rubber mesh, on the other hand, is usually softer than solder paste mesh, is made of mypolyester film, has a larger aperture, and is printed using an automatic press. Understanding these differences can help you better understand the role and function of these two items in SMT patch processing.