By recording and saving test data, the production process and test results of each product can be traced. If there is a quality problem, the test data can be traced back to the specific production batch and process, and the cause of the problem can be fur
Heat sink installation location: The heat sink should be installed near the components that generate a lot of heat on the circuit board to ensure that heat can be quickly transferred to the heat sink. At the same time, the space limitation of the radiator
Rf substrates are PCBA substrates specially designed for RF signal transmission and processing. They use special materials and wiring technology to ensure stability and low loss in the high frequency range. Rf substrates are widely used in wireless commun
Thick copper substrate is a PCBA substrate with a high copper layer thickness. They are suitable for applications that need to handle high currents and high power, such as electric vehicle battery management systems, industrial control equipment and power
Quality testing Quality testing is one of the important means to ensure that the quality of the products we produce is high. We need to conduct quality inspection at each step and a final inspection of the entire product before the final product leaves th
how should the solder paste splash? Solder paste spatter can cause component damage, even cause failure, improper use may cause harm to the operator. Therefore, to prevent solder paste spatter, we recommend the following measures
In PCBA processing, the skills and experience of employees are also very important. We need to train our employees regularly to ensure that they are up to date with the latest processes and technologies. This helps to improve the technical level and produ
SMT or surface mount technology is one of the most commonly used technologies in modern electronics production. It has been widely used in various fields, including automotive electronics, consumer electronics, industrial automation and so on. In the SMT
Analog and digital components should be placed in their own dedicated PCB area. The power supply should be placed at the edge or corner of the board and between the analog and digital areas.
The difference between leaded and lead-free processes is that the welding method is different. The lead process uses lead-tin alloy, the welding temperature is low, and the operation is relatively simple. Lead-free process is the use of lead-free solder i
Inspection and quality control: In the SMT patch processing process, the inspection and quality control of the solder paste process is essential. Common methods include solder paste viscosity test, solder joint appearance inspection and solder joint relia
This paper describes some of the key issues in system design, with a special focus on printed circuit board (PCB) ground and power plane wiring technologies. Modern ADCs require modern PCB board designs. Without an accurate clock source or carefully desig
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