Overcome the challenge of alignment of multiple connector groups between PCB boards
The procurement of certain PCB boards is controlled only by the specifications embedded in the Gerbe...
The procurement of certain PCB boards is controlled only by the specifications embedded in the Gerbe...
At present, there are two kinds of metallization methods for LTCC subgrade plate: thick film sinteri...
Low temperature co-fired ceramics (LTCC) is a multi-layer ceramic manufacturing technology that inte...
Although the miniaturization trend makes it more challenging, it is possible to use multiple connect...
Chip-on-chip (WCSP) or core-sized ball grid arrays (DSBGA) use fine-pitch wire bonding and flip-chip...
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corre...
In the core structure, all the conductive layers in the circuit board are coated on the core materia...
The progress and development of copper clad plate is also driven by the innovation and development o...
In order to achieve the smaller space, faster speed, higher performance of the goal, the printed cir...
If the transmission line is isotropic, there will always be a current as long as the signal is trans...
The properties of the developed substrate materials are provided to the designer of the whole electr...
The simultaneous dumping of current underground may temporarily raise the ground's electrical potent...