EMC specification for RF PCB design
In the actual design, the frequency, power rate and gain should be considered comprehensively to dec...
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PCB shield
The diode junction capacitance forms high-frequency attenuation oscillation, and the equivalent seri...
Capacitor configuration of PCB
The configuration of decoupling capacitance can suppress the noise caused by load changes, which is ...
Notes for RF circuit power supply design
Having a "noise-free" power supply is essential to optimizing system performance, although...
Reliability design of printed circuit board
It has been proved that the reliability of electronic equipment will be adversely affected even if t...
Noise reduction technology of DSP system
Electromagnetic compatibility (EMC) concerns both the emission and sensitivity of a system. If inter...
Matters needing attention for component packaging in RF circuit
RF designs must be thoroughly and carefully planned at the beginning of the design process, with a t...
Brief discussion on several important technical properties of PCB ink
PCB ink quality is excellent, in principle can not be separated from the combination of the above ma...
The technical requirements of high speed and high frequency copper clad plate for 5G communication
Thin substrate material should be selected for 5G high-frequency plate. Meanwhile, material characte...
The basic method to minimize RF effect in PCB interconnect design
This paper introduces various techniques of the three types of interconnect design, including device...
PCB technical requirements and difficulties of 5G communication products
In order to alleviate this design pressure, communication chip manufacturers have to choose to devel...
Practical problems of circuit board fine wire production
With the development of the electronic industry, the integration degree of electronic components is ...
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