Common defects on the copper surface of the substrate
the core board (GND to POWER) should not be too thick to reduce the distributed impedance of the pow...
the core board (GND to POWER) should not be too thick to reduce the distributed impedance of the pow...
In the rapid development of science and technology today, a variety of high-tech electronic products...
In this example of a four-layer PCB board, the designers used a solid ground plane located directly ...
This is because the PowerPCB database is too messy, which may be caused by too many modifications. T...
It is important to note that the final performance rating (assembly, welding, cleaning and testing) ...
Another important consideration when designing automotive system boards is grounding. Since the vehi...
The higher the Td, the slower the burn rate. Materials with Td equal to or below 300°C are suitable ...
Challenge: Equipment is expected or required to maintain as uniform surface pressure as possible to ...
Reflow welding: After the component is inserted, heat is started using an assembler. In this process...
During the manufacturing process, various conditions can and will cause solder bridging. Welding Bri...
SMT is not suitable and is not suitable for large parts, high power or high voltage - such as where ...
Assembly drawings vary according to different assembly templates. Most of the time, because electron...