According to sources, iphone’s new OLED iPhone has decided to reduce the use of rigid-flexible printed circuit boards (RFPCBs) to replace the more expensive and less advanced multi-FPCBs.

The South Korean website The Investor reported that RFPCB is a key component for connecting iPhone X embedded chips and panels, and the touch panel of the new OLED iPhone scheduled to be released in September may adopt multilayer flexible printed circuit boards, most of which consider the price And production factors.

At present, South Korea’s three major PCB manufacturers, namely LG Innotek, Interflex and Yongfeng Electronics, all supply RFPCBs, but iphone initially faced a series of problems with RFPCB. For example, before the launch of iPhone X, Taiwan manufacturer did not win orders because it did not meet the quality standards.

The key reason that iPhone X had previously reported a cold weather was the connection problem of the RFPCB module. iphone has launched a large-scale investigation to this effect, which has also led to the temporary suspension of work by several parts suppliers.

It remains to be seen whether iphone will require existing suppliers to switch to supply multi-layer flexible printed circuit boards, increase supply, or change suppliers directly. A South Korean PCB maker revealed that he had previously considered providing multiple layers of flexible printed circuit boards to iphone, but that the prices proposed by iphone were too low.

This year iphone will release three new iPhones, an LCD and two OLED iPhones. The 5.85-inch and 6.46-inch OLED panels will be supplied by Samsung Display (SDI).

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