PCB Assembly 10W 56mm Aluminum Plate
Name: PCB Assembly 10W 56mm Aluminum Plate
Substrate: FR-4, CEM-3, Aluminum
Layers: 1-22 layers
Maximum panel: 1550mm*800mm
Copper Thickness: 0.5oz, 1oz, 2oz, 3oz, 4oz
Dielectric thickness: 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm
Core thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm
Plate thickness: 0.4mm - 4.0mm
Thickness tolerance: +/-10%
Aluminum machining: provide drilling, tapping, milling, routing, punching, folding
Sensitive hole: 0.2 mm
Maximum working voltage: 2.5kVDC (0.075mm dielectric), 3.75kVDC (0.15mm dielectric)
Minimum track width: 0.2mm (8mil)
Minimum track clearance: 0.2mm (8mil)
Minimum SMD pad pitch: 0.2mm (8mil)
Surface treatment: HASL lead-free, immersion gold, immersion silver
Solder mask color: green, blue, etc.
Legend Color: Black, White, etc.
Electronic testing: yes
Certificate: UL/ROHS/ISO9001
Name: AC220V LED Panel PCB Assembly
Substrate: FR-4, CEM-3, Aluminum
Layers: 1-22 layers
Maximum panel: 1550mm*800mm
Copper Thickness: 0.5oz, 1oz, 2oz, 3oz, 4oz
Dielectric thickness: 0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm
Core thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm
Plate thickness: 0.4mm - 4.0mm
Thickness tolerance: +/-10%
Aluminum machining: provide drilling, tapping, milling, routing, punching, folding
Sensitive hole: 0.2 mm
Maximum working voltage: 2.5kVDC (0.075mm dielectric), 3.75kVDC (0.15mm dielectric)
Minimum track width: 0.2mm (8mil)
Minimum track clearance: 0.2mm (8mil)
Minimum SMD pad pitch: 0.2mm (8mil)
Surface treatment: HASL lead-free, immersion gold, immersion silver
Solder mask color: green, blue, etc.
Legend Color: Black, White, etc.
Electronic testing: yes
Certificate: UL/ROHS/ISO9001
PCB Assembly SMD 2835 Round Board
Name: PCB Assembly SMD 2835 Round Board
Number of layers: 1 layer
PCB thickness: 1.0-2.0mm
Copper Thickness: 1oz-2oz
Surface: HAL/OSP/LF-HAL
Thermal conductivity: 1.0-3 0w/mk
Solder Mask Type: Liquid Photosensitive Solder Marker
Accepting OEM orders for SMT and A/I assembly projects
SMD 2835 LED Light Module PCB Assembly
Name: SMD 2835 LED Light Module PCB Assembly
Number of layers: 1 layer
PCB thickness: 1.0-2.0mm
Copper Thickness: 1oz-2oz
Surface: HAL/OSP/LF-HAL
Thermal conductivity: 1.0-3 0w/mk
Solder Mask Type: Liquid Photosensitive Solder Marker
Accepting OEM orders for SMT and A/I assembly projects
Prototype PCB Assembly SMD Street Light LED
Name: Prototype PCB Assembly SMD Street Light LED
Material: CEM1, CEM3
Layers: 1~24 layers
Maximum / panel size: 541*647mm (special can be made 950mm)
Aspect Ratio: Minimum 1:8
Ring: Min. 0.1mm
Finished hole size: PTH ±0.003'', NPTH ±0.002"
Impedance control: ±5%
Solder Mask Registration: ±0.003"
Layer-to-layer registration: ±0.003"
PCB Project: PCB OEM/PCB Design/PCB Assembly
Surface treatment: HASL, OSP, ENIG, gold plated
Single Sided Aluminum Prototype PCB Assembly
Name: Single Sided Aluminum Prototype PCB Assembly
Layers: 1-20
Plate thickness: 0.20mm-4.0mm
Copper Thickness: 17.5um-175um (0.5oz-5oz)
Solder mask color: red, black, blue, green, yellow
Stencil cleaning frequency: 1 time/5 to 10 sheets
Surface treatment: spray tin, lead-free spray tin, OSP, gold plating, immersion gold
Minimum trace width: 0.15mm
minute. Line spacing: 3 mil (0.075 mm)
Minimum space width: 0.15mm
Substrate: FR4/Aluminum
Minimum drilling diameter: 0.2mm
Automotive Lighting LED PCB Assembly
Name: SMD LED chip PCB assembly
Material: Aluminum base
Voltage: 160-280V
Wattage: 3W
Chip: SMD-2835/5730/4014
Number of LEDs: 12
Diameter: 31mm
Temperature: 2700-6500k
T8/T5/LED slats/line lights SMT processing
Name: T8/T5/LED slat/line light SMT processing
Substrate Material: Aluminum
Copper thickness: 1.0-2.0mm
Copper Thickness: 0.5-6oz
Thermal conductivity: 1.0-3.0W/mk
Breakdown voltage: 2-4KV
Lead: SMD 2835
Flammability: 94V0
Solder mask: white
Silkscreen: black
Working temperature: -25-75℃
Service: OEM&ODM
Surface Treatment: HAL/OSP/Immersion Gold/Gold/Tin/Immersion Tin
- PCB Assembly Equipment
- PCB Assembly Capability
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
The LED PCB circuit is printed on an aluminum plate with good thermal conductivity, and then electronic components are soldered to it.