Smart Consumer Electronics Low Volume PCB Assembly
Name: Small batch wireless speaker PCB assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
Small batch car charger PCB assembly
Name: Small batch car charger PCB assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
Automotive Electronics PCB Assembly
Name: Automotive Electronics PCB Assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
Small batch PCB assembly patch
Name: Small batch PCB assembly patch
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
Equipment Development PCB Assembly
Name: Equipment Development PCB Assembly
Substrate: FR-4/High TG/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
Small batch PCBA assembly supplier
Name: Small batch PCBA supplier
Substrate: FR-4/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
Device Development Board SMT Assembly
Name: Device Development Board SMT Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
LED Printed circuit board Assembly
Name: LED PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
Control Board Low Volume PCB Assembly
Name: Control Board Low Volume PCB Assembly
Substrate: FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
Copper Thickness: 1/3OZ- 6OZ
Plate thickness: 0.21-6.0mm
minute. Hole size: 0.20mm
minute. Line width: 4 million
minute. Line spacing: 0.075 mm
Surface treatment: spray tin/gold drill/OSP/lead-free spray tin
Board size: minimum 10*15mm, maximum 508*889mm
Product Type: OEM&ODM
PCB standard: IPC-A-610 D/IPC-III standard
Certificate: ISO9001/ CE//TUV/ ROHS
Warranty: 1 year
Service: One-stop turnkey service
Electronic testing: 100%
Logistics: Air/Sea
- PCB Assembly Equipment
- PCB Assembly Capability
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |