Medical PCB Board Blood Pressure Monitor PCBA Assembly Supplier
PCB Assembly Name:Medical PCB Board Blood Pressure Monitor PCBA Assembly Supplier
Surface Finishing:HASL, Enig, OSP, Immersion Au, AG, Sn
MOQ:1 PCS
Layer:1-18 Layer
Copper Thickness:0.5oz-6oz
Board Thickness:0.2mm-4mm
Min.Hole Size:0.1mm (4 Mil)
Min.Line Spacing:0.1mm (4 Mil)
PCBA QC:X-ray, Aoi Test, Function Test(100% Test)
Specialised:Consumer, LED, Medical, Industrial, Control Board
Delivery:PCB, 7-10 Days;PCBA, 2-3weeks
Service:PCBA/PCB Assembly/PCB Circuit Board
Other Service:PCB/PCB Layout and Design, Engineering Support
Transport Package:Vacuum Packing/Blister/Plastic /Cartoon
Specification:CE, RohS, UL, SGS, ISO9001: 2015, ISO 14001
Trademark:One Stop Manufacturer PCBA PCB Assembly
Origin:Shenzhen, Guangdong
Production Capacity:5, 000, 000PCS /Month
Precision Medical Equipment Circuit Board PCBA RoHS PCB Board Assembly
Name:Precision Medical Equipment Circuit Board PCBA RoHS PCB Board Assembly
Metal Coating:Silver,Copper,Gold,Tin
Mode of Production:SMT
Layers:Multilayer
Base Material:Fr4 Tg130,150,Tg170 /Aluminum
Certification:RoHS, ISO
Customized:Customized
Condition:New
Solder Mask Color:Black.Red.Yellow.White.Blue.Green
Testing Service:Aoi+100% Electrical Test
SMT Efficiency:BGA.Qfp.Sop.Qfn.Plcc.Chip
PCBA Service:One Stop Turnkey PCBA Service
Copper Thickness:1 Oz, 0.5-6oz
Supplier Type:OEM/EMS
Min. Hole Size:0.2mm
Min. Line Spacing:0.075m
Min. Line Width:0.127mm
Layer Available:1-24 Layers PCB Board
Transport Package:Anti-Static Packing
Specification:can make Blind Vias+Controlled Impedance+BGA
Origin:China
OEM Turnkey high frequency Medical pcb circuit board manufacturer medical pcb assembly
Name:Medical device PCB assembly
Metal Coating:Silver,Copper,Gold,Tin
Mode of Production:SMT
Layers:Multilayer
Base Material:Fr4 Tg130,150,Tg170 /Aluminum
Certification:RoHS, ISO
Customized:Customized
Condition:New
Solder Mask Color:Black.Red.Yellow.White.Blue.Green
Testing Service:Aoi+100% Electrical Test
SMT Efficiency:BGA.Qfp.Sop.Qfn.Plcc.Chip
PCBA Service:One Stop Turnkey PCBA Service
Copper Thickness:1 Oz, 0.5-6oz
Supplier Type:OEM/EMS
Min. Hole Size:0.2mm
Min. Line Spacing:0.075m
Min. Line Width:0.127mm
Layer Available:1-24 Layers PCB Board
Transport Package:Anti-Static Packing
Specification:can make Blind Vias+Controlled Impedance+BGA
Origin:China
- PCB Assembly Equipment
- PCB Assembly Capability
SMT capacity: 19 million points/day | ||
Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
Mounted Component Specifications | Pasteable smallest package | |
Minimum device accuracy | ||
IC type chip accuracy | ||
Mounted PCB Specifications | Substrate size | |
Substrate thickness | ||
throw rate | 1. Resistance-capacitance ratio 0.3% | |
2. IC type without throwing material | ||
Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
DIP daily production capacity | ||
DIP plug-in production line | 50000 points/day | |
DIP post welding production line | 20000 points/day | |
DIP test production line | 50000pcs PCBA/day | |
Assembly processing capability | ||
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
PCBA processing capability | ||
project | Mass processing capability | Small batch processing capability |
Number of layers (max) | 2-18 | 20-30 |
Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
Rogers,etc Teflon | E-65, ect | |
Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
biggest size | 610mm X 1100mm | / |
Dimensional Accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
Thickness tolerance (t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
Minimum line width | 0.10mm | 0.075mm |
Minimum spacing | 0.10mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
Hole Tolerance (Mechanical Drill) | 0.05mm | / |
Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
Laser Drilling Aperture | 0.10mm | 0.075mm |
Plate thickness aperture ratio | 10:1 | 12:1 |
Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
Impedance tolerance | ±10% | ±5% |
Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |