Name: 2OZ oz aluminum base circuit board
Number of layers: single-sided aluminum substrate
Plate thickness: 2.0MM
Copper thickness: 2OZ oz
Color: white text
Surface treatment: spray tin process
Breakdown voltage: 3000V
Thermal conductivity - thermal conductivity (W/m-k): 2.0
Application field: LED lighting
Thermoelectric separation copper-based circuit board
Name: Thermoelectric separation copper-based circuit board
Plate thickness: 2.0MM
Copper foil thickness: 3OZ
Thermal conductivity: 398w/m.k
Withstand voltage: AC1500V
Solder mask type: white oil
Surface treatment: OSP
E-T test: 100% computer open and short test
Production process: thermoelectric separation process
High thermal conductivity aluminum-based circuit board
Name: High thermal conductivity aluminum base circuit board
Number of layers: single-layer aluminum substrate
Plate thickness: 1.5MM
Copper thickness: 1OZ
Surface treatment: tin spray
Color: white oil black
Thermal conductivity: 3.0 (W/mk)
Withstand voltage KV: 1.5-3.5KV/AC
Application field: mining machine lighting
High thermal conductivity copper substrate
Name: High thermal conductivity copper substrate
Plate thickness: 1.0MM
Copper foil thickness: 2OZ
Withstand voltage: AC2000V
Thermal conductivity: 398w/m.k
Solder mask type: black oil
Surface Treatment: Immersion Gold
E-T test: 100% computer open and short test
Production process: thermoelectric separation process
Product name: Copper base circuit board
Plate thickness: 1.6MM
Copper foil thickness: 2OZ
Withstand voltage: AC2000V
Thermal conductivity: 398w/m.k
Solder mask type: white oil
Surface treatment: OSP
E-T test: 100% computer open and short test
Production process: thermoelectric separation process
Aluminum Core LED MC Single Sided PCB
Name: Aluminum Core LED MC Single Sided PCB
Layers: 1
Material: Aluminum (metal core)
Thermal conductivity: 0.8, 1.5, 2.0, 3.0 W/mK
Thickness: 0.5-3mm
Copper thickness: 0.5-10OZ
Outline: Wiring, Punching, V-Cut
Solder mask: white/black/blue/green/red oil
Legend/Silkscreen Color: Black/White
Surface treatment: immersion gold, spray tin, OSP
Maximum panel size: 600*500mm
Packing: vacuum/polybag
Application: LED field
Name: Metal Core Copper Base MC PCB
Number of layers: 2 layers of MCPCB
Material: copper base
Raw materials: aluminum core, copper core, iron core
Size: 8*8CM
There are two types of plated holes:
a) Signal PTH between TOP and BOT side, no connection on Cu core
b) Cool the PTH connected to the copper core.
There are two types of plated holes:
a) Signal PTH between TOP and BOT side, no connection on Cu core
b) Cool the PTH connected to the copper core
- PCB Manufacturing Equipment
- PCB Capability
PCB Drilling machine
PCB pattern plating line
PCB solder mask expose machine
PCB pattern expose machine
Strip film etching line
Solder mask screen silk print machine
Solder mask scrubbing line
PCB Flying Probe Test (FPT)
Fully automatic exposure machine
| Item | Capability |
| Layer Count | 1-40layers |
| Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) |
| Board Type | Backplane、HDI、High multi-layer 、blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. |
| Board Thickness | 0.2-5.0mm |
| Copper Thickness | Min. 1/2 OZ, Max. 10 OZ |
| PTH Wall | 25um(1mil) |
| Maximum Board Size | 1100*500mm(43”*19”) |
| Min laser drilling size | 4mil |
| Min. Spacing/Tracing | 2.7mil/2.7mil |
| Solder Mask | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy |
| Surface Treatment | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger. |
| Min. Annular Ring | 3mil |
| Aspect ratio | 10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) |
| Impedance control | ±5ohm(＜50ohm), ±10%(≥50ohm) |
| Other Techniques | Blind/Buried Via |
| Gold Fingers | |
| Press Fit | |
| Via in Pad | |
| Electrical Test |
High-standard confidentiality measures, signing confidentiality agreements, and all documents exporting must be approved to ensure that 100% of documents are not leaked.
we provide 24-hour service and support, you will receive a reply to your question within 2 hours and a quotation within 24 hours.
We can provide you with high frequency, high TG, high CTI, buried blind via, aluminum based PCB manufacturing, the quality is fully compliant with IPC 610-D standard, testing and quality assurance
With more than 20 years of industry experience, technology and production capacity are constantly increasing, and we can provide one-stop services from standard PCB to HDI PCB, high frequency and high...
Kingford has stable material suppliers with ten years of cooperation, such as Shengyi Technology, ITEQ, ROGERS, AGC, DUPONT, Doosan, Mitsubishi, etc.
The thicker the copper, the greater the loaded current load, and the transmission current and heat w...
Copper PCB thermal electricity separation process technical steps1. First cut the copper foil substr...
The heating welding foot of this product component uses the hollow port of the circuit board to dire...
The substrate thermal conductivity can be found in the test instruments after the plate is pressed. ...
1.PCB copper -covered copper -covering plate is a plate -shaped material made of glass fiber cloth o...
MCPCB aluminum substrate structureThe MCPCB aluminum substrate structure consists of circuit layer (...
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