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Multilayer Printed Circuit Board(PCB) Fabrication
Name: Multilayer PCB
Material: KB6061, S1141, S1000, IT180
Layer: 4Layer - 48Layer Multilayer PCB
Solder Mask Color: Green/White/Blue/Red
Silk Screen Color: White/Black
Finished Thickness: 0.3mm - 6.0mm
Copper Thickness: 0.5-6OZ
Surface Treatment: Immersion Gold/OSP/HASL
Min Trace: 3mil(0.75mm)
Min Space: 3mil(0.75mm)
Application: Consumer electronics
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Name: Medical device PCB
Substrate: FR4
Laminate: 8L
Dielectric constant: 4.2
Plate thickness: 1.6MM
Outer copper foil thickness: 1oz
Inner copper foil thickness: 1oz
Minimum aperture: 0.2mm
Minimum line width: 0.1MM
Minimum line spacing: 0.1MM
Gold Thickness: 1U"
Application field: medical PCB
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Name: Medical Equipment PCB
Substrate: FR4 Shengyi
Laminate: 6L
Dielectric constant: 4.2
Plate thickness: 1.6MM
Outer copper foil thickness: 1oz
Inner copper foil thickness: 1oz
Minimum aperture: 0.2mm
Minimum line width: 0.1MM
Minimum line spacing: 0.1MM
Gold Thickness: 1U"
Impedance requirements: L1, L3, 100 ohms
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Name: 10-layer PCB circuit board
Layers: 10L
Sheet: FR4 Tg170
Plate thickness: 2.4mm
Panel size: 120*95mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.25mm
Line width line spacing: 3/3.2mil
Surface treatment: Immersion gold 2U''
Application field: network communication PCB board
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Name: 14-layer PCB circuit board
Layers: 14L
Sheet: FR4 Tg180
Plate thickness: 2.4mm
Panel size: 120*95mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.25mm
Line width line spacing: 3/3.2mil
Surface treatment: Immersion gold 2U''
Application field: automotive core PCB board
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Name: 12-layer PCB circuit board
Layers: 12L
Sheet: FR4 Tg150
Plate thickness: 1.2mm
Panel size: 114*96mm/2
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.35mm
Line width line spacing: 3.8/3.8mil
Surface treatment: Immersion gold 2U''
Application field: RK3399 development board
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Name:Power Module PWB
Material : High TG FR4
Layer : 12Layers
Color : Green/White
Finished Thickness : 1.0mm
Copper Thickness : 2-3OZ
Surface Treatment : Immersion Gold
Min Trace : 8mil(0.2mm)
Min Space : 8mil(0.4mm)
Application : Power Module PWB
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Name: 8-layer PCB circuit board
Layers: 8L
Sheet: FR4 Tg150
Plate thickness: 1.6mm
Panel size: 145*119mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.35mm
Line width line spacing: 3.8/3.2mil
Surface treatment: Immersion gold 2U''
Application field: face recognition PCB
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6-layer industrial control PCB motherboard
Name: 6-layer industrial control PCB motherboard
Layers: 6L
Sheet: FR4 Tg150
Plate thickness: 1.6mm
Panel size: 190*150mm/2
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.35mm
Line width line spacing: 3/3mil
Surface treatment: Immersion gold 2U''
Application field: industrial control
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24-layer high-density high-speed PCB
Name: 24-layer high-density high-speed PCB
Material: TU872SLK
Layers: 24 layers
Thickness: 3.2±0.32mm
Minimum diameter mechanical hole: 0.25mm
Minimum track/spacing: 75/75um
Minimum plate thickness and hole ratio: 12.8:1
Surface treatment: Immersion Gold (ENIG) 0.05um
Application field: aerospace
- PCB Manufacturing Equipment
- Multilayer PCB Capability
PCB Drilling machine
PCB pattern plating line
PCB solder mask expose machine
PCB pattern expose machine
Strip film etching line
Solder mask screen silk print machine
Solder mask scrubbing line
PCB Flying Probe Test (FPT)
Fully automatic exposure machine
Multilayer PCB Production Capability | |
Item | Capability |
Layer Count | 1-40layers |
Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) |
Board Type | Backplane、HDI、High multi-layer 、blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. |
Board Thickness | 0.2-5.0mm |
Copper Thickness | Min. 1/2 OZ, Max. 10 OZ |
PTH Wall | 25um(1mil) |
Maximum Board Size | 1100*500mm(43”*19”) |
Min laser drilling size | 4mil |
Min. Spacing/Tracing | 2.7mil/2.7mil |
Solder Mask | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy |
Surface Treatment | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger. |
Min. Annular Ring | 3mil |
Aspect ratio | 10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) |
Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
Other Techniques | Blind/Buried Via |
Gold Fingers | |
Press Fit | |
Via in Pad | |
Electrical Test |
We can provide the highest precision boards with up to 2 to 64 layers.
Yes, we offer multilayer PCB manufacturing with dense and high count multilayer boards.
Multilayer PCB manufacturing or production is the process of manufacturing a PCB with more than two layers combined; the characteristics of a multilayer PCB may require a more complex design than a double-sided PCB!