Multilayer Printed Circuit Board(PCB) Fabrication
Name: Multilayer PCB
Material: KB6061, S1141, S1000, IT180
Layer: 4Layer - 48Layer Multilayer PCB
Solder Mask Color: Green/White/Blue/Red
Silk Screen Color: White/Black
Finished Thickness: 0.3mm - 6.0mm
Copper Thickness: 0.5-6OZ
Surface Treatment: Immersion Gold/OSP/HASL
Min Trace: 3mil(0.75mm)
Min Space: 3mil(0.75mm)
Application: Consumer electronics
Name: Medical device PCB
Substrate: FR4
Laminate: 8L
Dielectric constant: 4.2
Plate thickness: 1.6MM
Outer copper foil thickness: 1oz
Inner copper foil thickness: 1oz
Minimum aperture: 0.2mm
Minimum line width: 0.1MM
Minimum line spacing: 0.1MM
Gold Thickness: 1U"
Application field: medical PCB
Name: Medical Equipment PCB
Substrate: FR4 Shengyi
Laminate: 6L
Dielectric constant: 4.2
Plate thickness: 1.6MM
Outer copper foil thickness: 1oz
Inner copper foil thickness: 1oz
Minimum aperture: 0.2mm
Minimum line width: 0.1MM
Minimum line spacing: 0.1MM
Gold Thickness: 1U"
Impedance requirements: L1, L3, 100 ohms
Name: 10-layer PCB circuit board
Layers: 10L
Sheet: FR4 Tg170
Plate thickness: 2.4mm
Panel size: 120*95mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.25mm
Line width line spacing: 3/3.2mil
Surface treatment: Immersion gold 2U''
Application field: network communication PCB board
Name: 14-layer PCB circuit board
Layers: 14L
Sheet: FR4 Tg180
Plate thickness: 2.4mm
Panel size: 120*95mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.25mm
Line width line spacing: 3/3.2mil
Surface treatment: Immersion gold 2U''
Application field: automotive core PCB board
Name: 12-layer PCB circuit board
Layers: 12L
Sheet: FR4 Tg150
Plate thickness: 1.2mm
Panel size: 114*96mm/2
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.35mm
Line width line spacing: 3.8/3.8mil
Surface treatment: Immersion gold 2U''
Application field: RK3399 development board
Name:Power Module PWB
Material : High TG FR4
Layer : 12Layers
Color : Green/White
Finished Thickness : 1.0mm
Copper Thickness : 2-3OZ
Surface Treatment : Immersion Gold
Min Trace : 8mil(0.2mm)
Min Space : 8mil(0.4mm)
Application : Power Module PWB
Name: 8-layer PCB circuit board
Layers: 8L
Sheet: FR4 Tg150
Plate thickness: 1.6mm
Panel size: 145*119mm/1
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.35mm
Line width line spacing: 3.8/3.2mil
Surface treatment: Immersion gold 2U''
Application field: face recognition PCB
6-layer industrial control PCB motherboard
Name: 6-layer industrial control PCB motherboard
Layers: 6L
Sheet: FR4 Tg150
Plate thickness: 1.6mm
Panel size: 190*150mm/2
Outer copper thickness: 35μm
Inner layer copper thickness: 35μm
Minimum through hole: 0.20mm
Minimum BGA: 0.35mm
Line width line spacing: 3/3mil
Surface treatment: Immersion gold 2U''
Application field: industrial control
24-layer high-density high-speed PCB
Name: 24-layer high-density high-speed PCB
Material: TU872SLK
Layers: 24 layers
Thickness: 3.2±0.32mm
Minimum diameter mechanical hole: 0.25mm
Minimum track/spacing: 75/75um
Minimum plate thickness and hole ratio: 12.8:1
Surface treatment: Immersion Gold (ENIG) 0.05um
Application field: aerospace
- PCB Manufacturing Equipment
- Multilayer PCB Capability
Multilayer PCB Production Capability | |
Item | Capability |
Layer Count | 1-40layers |
Base Material | KB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4) |
Board Type | Backplane、HDI、High multi-layer 、blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill. |
Board Thickness | 0.2-5.0mm |
Copper Thickness | Min. 1/2 OZ, Max. 10 OZ |
PTH Wall | 25um(1mil) |
Maximum Board Size | 1100*500mm(43”*19”) |
Min laser drilling size | 4mil |
Min. Spacing/Tracing | 2.7mil/2.7mil |
Solder Mask | Green, Black, Blue, Red, White, Yellow, Purple matte/glossy |
Surface Treatment | Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead-free 、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger. |
Min. Annular Ring | 3mil |
Aspect ratio | 10:1(HASL Lead-free 、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP) |
Impedance control | ±5ohm(<50ohm), ±10%(≥50ohm) |
Other Techniques | Blind/Buried Via |
Gold Fingers | |
Press Fit | |
Via in Pad | |
Electrical Test |
We can provide the highest precision boards with up to 2 to 64 layers.
Yes, we offer multilayer PCB manufacturing with dense and high count multilayer boards.
Multilayer PCB manufacturing or production is the process of manufacturing a PCB with more than two layers combined; the characteristics of a multilayer PCB may require a more complex design than a double-sided PCB!