After years’ R&D, Kingford is having more and more mature technology about Any layer HDI PCB.

In May, 2014, we successfully finish over 100sq.m mass production of 8 layer with such tech. Below includes the details about stackup and finished product. After this project, we got much experience of manufacturing. We shall search for more method to have cost down and finally get more competitive for our end customer in the future market of 4G and 5G equipment!

The production lines for HDI and any ayer boards at Taiwan’s major PCB makers, including Unimicron Technology, Compeq Manufacturing, Tripod Technology, and Unitech Printed Circuit Board, are likely to run at full capacity through June due to strong demand from the smartphone sector, according to industry sources.


Most makers’ production lines for HDI and any-layer boards have been operating at 80 to 90% of their capacity since April thanks to the roll-outs of new smartphones by vendors including Sony Mobile Communications, HTC, Asustek Computer, Xiaomi Technology, ZTE, Huawei, Lenovo, and Oppo, indicated the sources.

The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufacturing. Compeq and Japan-based Ibiden are currently the two PCB firms ramping up their capacities for any-layer HDI boards with new production lines to come online in the second half of 2014.




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