SMT Solder Paste Printing Affects Product Quality

SMT Solder Paste Printing Affects Product Quality
PCB has many electronic component pin solder joints, which are called pads (PAD) In the SMT mounting process, in order to apply solder paste on a specific pad, it is necessary to make a steel plate corresponding to the pad position and install it on the solder paste printer By monitoring and repairing the PCB position of the base plate, ensure that the position of the steel plate mesh is the same as that of the pad on the PCB After positioning, the scraper on the solder paste printer moves back and forth on the mold, and the solder paste passes through the mesh on the steel plate and covers the specific pads (PAD) of the PCB to complete the solder paste printing
Printing solder paste on PCB and connecting electronic components to PCB through reflow furnace is a common method in today's electronic manufacturing industry. The printing of solder paste is a little like the painting on the wall. The difference is that in order to apply solder paste to a specific position and control the quantity of solder paste more accurately, a more accurate special steel plate (mold) must be used to control the solder paste. Solder paste printing.
SMD Solder Paste Printing
The quality of solder paste printing is the basis of printing quality PCB welding The position and quantity of solder paste are more important We often see that the solder paste is not printed well And other problems appear.  However, if you really want to print solder paste, you must consider the following factors:
Scraper: suitable scraper shall be selected for solder paste printing according to the characteristics of different solder pastes or red glue. At present, the scraper used for solder paste printing is made of stainless steel.
Circuit board

Scraper angle: the angle at which the scraper scrapes the solder paste.
Scraper pressure: The pressure of the scraper will affect the volume of the solder paste. In principle, when other conditions remain unchanged, the greater the pressure of the scraper, the less solder paste will be used. Due to the high voltage, it is equivalent to compressing the gap between the steel plate and the PCB.
Scraper speed: The speed of the scraper will directly affect the shape and quantity of solder paste printing and the quality of solder. Generally, the speed of the scraper is set between 40-80mm/s. In principle, the speed of the scraper must match the viscosity of the solder paste. The better the fluidity of solder paste, the faster the speed of the scraper, otherwise it is easy to exude.
Surface mount technology is a new type of electronic assembly technology and one of the key technologies in electronic product manufacturing The formulation of "Made in China 2025", smart manufacturing, as the main attack direction, is the core technology of a new round of industrial revolution, and has become the national war Integrate the concepts of SMT and smart manufacturing to establish an efficient, agile and resource sharing SMT intelligent manufacturing model is the future development direction of the electronic product manufacturing industry and an important way to improve the manufacturing capabilities and levels of SMT products.

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