​What are the test forms of flexible circuit board patch?

What are the test forms of flexible circuit board patch?

What are the test forms of flexible circuit board patch introduced by PCB design and PCB processing manufacturers?

Flexible Printed Circuit Board (FPC) is referred to as "flexible board", commonly known as FPC in the industry. It is a flexible insulating substrate (mainly polyimide or polyester film) The printed circuit board has many advantages that the hard printed circuit board does not have. For example, it can bend, wind and fold freely. The volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras and other fields or products.

The process flow of flexible circuit board mounting is complex. During production and processing, various problems may occur due to improper equipment or operation, which cannot ensure that the products produced are qualified. Therefore, flexible circuit board mounting test is required to ensure that each product will not have quality problems. What are the test forms of flexible circuit board mounting?



Flexible circuit board mounting test mainly includes ICT test, FCT test, aging test, fatigue test, and harsh environment test.

1. ICT test: including circuit on-off, voltage and current values and fluctuation curves, amplitude, noise, etc.

   
   

2. FCT test: IC program burning is required, the function of the whole flexible circuit board patch board is simulated, and problems in hardware and software are found, and necessary production jigs and test racks are equipped.

3. Fatigue test: sample the flexible circuit board and patch board, conduct high-frequency and long-term operation of functions, observe whether there is failure, judge the probability of failure, and feed back the working performance of flexible circuit board and patch board in electronic products.

4. Testing in harsh environment: expose the flexible circuit board patch board to the temperature, humidity, drop, splash and vibration of the limit value, and obtain the test results of random samples, so as to infer the reliability of the whole batch of flexible circuit board patch board products.

5. Aging test: power on the flexible circuit board patch board and electronic products for a long time to keep them working and observe whether there is any failure. Only electronic products after aging test can be sold in batches.