Digital Image in PCB Design and Manufacturing

Digital Image in PCB Design and Manufacturing
Reliability is a very important problem in PCB manufacturing The most effective way is to actively design its reliability, rather than hoping it will work well and retrospectively There are many factors affecting reliability; Many of them are related to understanding the behavior and interaction of data in the process of operation Therefore, it is very important to study the thermal expansion coefficient or transition temperature of data Selecting the wrong information can have many effects, including but not limited to stresses in components and joints
What is an effective digital image correlation method in PCB manufacturing
A very useful tool for implementing the reliability process is digital image correlation or DIC, which is often referred to as.
The basic function of the technology is to actively measure efficiency and provide reliable value. This is to ensure that no error will occur no matter when selecting data or testing monitoring or analogy! Digital image correlation or DIC is basically an optical method for measuring displacement and deformation. In this method, a pattern of contrasting spots is used to create a sample. You can then track the sample to see its deformation. Its advantage is that it does not need to touch the sample. In addition, DIC can generate full field displacement, which is impossible in other methods. DIC can also be completed with only one monitor. However, if out of plane measurements are required, multiple cameras are required. This can be done regardless of sample size.
Circuit board

Because of its ease of use, this technology has become increasingly popular in many mechanical testing applications. As computer technology and digital cameras show significant technological progress, the use of DIC will only increase. This, DIC is being extended to any imaging technology. It is particularly useful in lead-free PCB manufacturing.
Five reasons why digital image correlation is beneficial:
Data properties DIC can be used to describe a large number of data properties, such as:
Young modulus
Poisson's ratio
Thermal expansion coefficient, etc
Therefore, this helps to obtain the best information about PCB laminates It can also help identify welding fatigue risks
2. Testing and monitoring digital image correlation is helpful to study displacement and strain measurement. It can help monitor elements such as tensile and bending tests.
Warpage Warpage is usually a problem during reflow soldering. If there is a lot of warpage, there are many problems, such as interconnection formation, solder joint bridging, and even fear of component cracking. DIC can help identify warpage and thus improve reliability.
4. Finite Element Analysis (FEA) - By using DIC, you can test the properties of the input data and the analog results. Problem strain areas often occur in complex components. Through the finite element analysis results, the problem is significantly reduced.
Dynamic applications In addition to static applications, DIC can also be used for dynamic applications, such as vibration testing.
Therefore, the advantages of DIC in lead-free environment cannot be overemphasized By using this technology, you can rest assured that PCB manufactured with this pipe will reach its reliability benchmark

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