Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13923401642Mon.-Sat.08:00-20:00
| Process | Item | Unit | Process Capability((sample)) | Process Capability(Production) | |
| Basic Information | Surface | Surface Treatment | Tin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard Gold | Tin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard Gold | |
| Selective Surface Treatment | ENIG+OSP，ENIG+Gold Finger，Gold Finger+HASL，Flash Gold+Gold Finger，Immersion Silver+Gold Finger，Immersion Tin+Gold Finger | ENIG+OSP，ENIG+Gold Finger，Gold Finger+HASL，Flash Gold+Gold Finger，Immersion Silver+Gold Finger，Immersion Tin+Gold Finger | |||
| Products Capabiity | Layer Count | Layer | 0-30(≥26 Layers needs Review） | 0-12(≥10 Layers needs Review） | |
| Bow and Twist | % | 0.75(≤0.5needs Process Review） | 0.75(≤0.5needs Process Review） | ||
| Min finished size | mm | 10*10mm | Need panel | ||
| Max finished Size (≥4L) | mm | 450*900mm | 500*600mm | ||
| Multi-press for Blind/Buried Vias | / | Multi-press Cycle≤4 times(Needs review for 2 cycles pressing) | Multi-press Cycle≤2times | ||
| Max finished Size (Double Sides) | mm | 450*1450mm | 490*900mm | ||
| Finished Board Thickness | mm | 0.30-3.0(≤0.3mm Needs Review),≤0.5mm for HASL | 0.3-4.0(≤0.3mm Needs Review),≤0.5mm for HASL | ||
| Finished Board Thickness Tolerance(≤1.0mm) | mm | ±0.1 | ±0.1 | ||
| Finished Board Thickness Tolerance(>1.0mm) | mm | Material Thickness±10% | Material Thickness±10% | ||
| Unspecified Finished Board Thickness Tolerance（No stack up requirements） | mm | Multilayer：≤2.0mm can±0.1；2.0-3.0mm can±0.15；≥3.0mm can±0.2；Double Sides+/-10% | Multilayer：≤2.0mm can±0.1；2.0-3.0mm can±0.15；≥3.0mm can±0.2；Double Sides+/-10% | ||
| Reliable Test | Peel Strength | N/cm | 7.8 | 7.8 | |
| Flammability | 94V-0 | 94V-0 | |||
| Ionic Contamination | ug/cm2 | ≤1 | ≤1 | ||
| Min Dielectric Thickness | mm | 0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80% | 0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80% | ||
| Impedance Tolerance | % | ±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%（Needs Review） | ±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%（Needs Review） | ||
| Base Material Type | Material Type | High Tg Material | Shengyi Tg>170℃ ;ITEQ 180 ;KB6168 | Shengyi Tg>170℃ ;ITEQ 180 ;KB6168 | |
| Impedance Control Material | Others need Review | FR-4,FR-4 HighTg Series | FR-4,FR-4 HighTg Series | ||
| RCC Material | Needs Review | Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um) | Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um) | ||
| Prepreg Type | FR-4 Prepreg、LD-1080（HDI） | 7628 2116 1080 3313 106 | 7628 2116 1080 3313 106 | ||
| Copper foil | Copper Foil | um | 12、18、35、70、105、140、175 | 12、18、35、70、105、140、175 | |
| Innerlayer & Outerlayer Image Transfer | Machine | Scrubbing Machine | 0.11-3.2mm,min 9*9inch | 0.11-3.2mm,min 9*9inch | |
| Innerlayer Process Capability | laminator, Exposer | 0.11-6.0mm,min 8*8in,max 24*24in | 0.11-6.0mm,min 8*8in,max 24*24in | ||
| Etching Line | 0.11-6.0mm,min 7*7inch | 0.2-6.0mm,min 7*7inch | |||
| Min Inner Line Width/Space(18um copper foil,Before Compensation) | mil | 3.2/3.2mil | 4/4mil | ||
| Min Inner Line Width/Space(35um copper foil,Before Compensation) | mil | 4/4mil | 4.5/4.5mil | ||
| Min Inner Line Width/Space(70um copper foil,Before Compensation) | mil | 7/7mil | 8/7.5mil | ||
| Min Inner Line Width/Space(105um copper foil,Before Compensation) | mil | 10/10mil | 12/12mil | ||
| Min Inner Line Width/Space(140um copper foil,Before Compensation) | mil | 12/13mil | 13/14mil | ||
| Min Inner Line Width/Space(175um copper foil,Before Compensation) | mil | 17/17mil | 17/17mil | ||
| Min Inner Line Width/Space(210um copper foil,Before Compensation) | mil | 25/21mil | 25/21mil | ||
| Min Spacing from hole edge to conductive | mil | ≤6L 6.5mil（Partial 7mil）、≤10L 8.5mil（Partial 8mil）≤12L 10mil（Partial 9mil) | ≤6L 8mil（Partial 7mil）、≤12L 10mil（Partial 9mil) | ||
| Innerlayer & Outerlayer Image Transfer | Innerlayer Process Capability | Min Innerlayer Annular Ring | mil | 3(18,35um,Partial3.5),6(70um),8(105um) | 5(18,35um,Partial3.5),7(70um),10(105um) |
| Min Innerlayer Isolation Clearance | mil | Conductive to Conductive 10mil(Partial 8mil) | Conductive to Conductive 12mil(Partial 8mil) | ||
| Min Spacing from board edge to conductive | mil | 8（except for blind vias）、10（Blind Vias） | 10（except for blind vias）、12（Blind Vias） | ||
| Min Gap width between copper ground | mil | 5(35um base copper) ≥2pcs （≥70um needs review) | 8(35um base copper) ≥2pcs （≥70um needs review) | ||
| Different copper thckness for inner core | um | 18/35,35/70(needs review） | 18/35,35/70(needs review） | ||
| Max Finished Copper Thickness | oz | 10OZ(175um)、≥6OZ needs review | 4OZ(140um) | ||
| Outer layer Process Capability | Min Outer Line Width/Space(6-9um base copper，before compensation) | mil | 3/3mil(achieve copper Thickness25um-30um) | 3.2/3.2mil(achieve copper Thickness25um-30um) | |
| Min Outer Line Width/Space(12um base copper，before compensation) | mil | 3/3mil(achieve copper Thickness30um-35um) | 3.5/3.5mil(achieve copper Thickness30um-35um) | ||
| Min Outer Line Width/Space(18um base copper，before compensation) | mil | 4/4mil | 4.5/4.5mil | ||
| Min Outer Line Width/Space(35um base copper，before compensation) | mil | 5/6mil | 5.5/6.5mil | ||
| Min Outer Line Width/Space(70um base copper，before compensation) | mil | 7/7mil | 8/8mil | ||
| Min Outer Line Width/Space(105um base copper，before compensation) | mil | 9/10mil | 12/11mil | ||
| Min Outer Line Width/Space(140um base copper，before compensation) | mil | 12/12mil | 16/14mil | ||
| Min Outer Line Width/Space(175um base copper，before compensation) | mil | 17/16mil | 20/18mil | ||
| Min Outer Line Width/Space(210um base copper，before compensation) | mil | 24/22mil | 28/25mil | ||
| Min Grid Line Width | mil | 5（12、18、35 um），8（70 um） | 5（12、18、35 um），10（70 um） | ||
| Min Grid Spacing | mil | 5（12、18、35 um），8（70 um） | 5（12、18、35 um），10（70 um） | ||
| Min Hole Pad Diameter | mil | 12(0.10mm mechanical or Laser Drill) | 12(0.10mm mechanical or Laser Drill) | ||
| Min PP thickness | 2oz: 6mil 3oz: 8mil 4oz:10mil 5oz: 12mil 6oz:14mil | ||||
| Innerlayer & Outerlayer Image Transfer | Process Capability | Max size for slot tenting | 5mm*3.0mm；the tent land should >10mil | 5mm*3.0mm；the tent land should >10mil | |
| Max diameter for tenting hole | mm | 4.5 | 4.5 | ||
| Min tent land width | mil | 6 | 6 | ||
| Min annular ring（after compensation, except for blind vias） | mil | 4(12、18um) Partial 3.5、4.5(35um)、 6(70um)、8(105um)、10（140um） | 4(12、18um) 、5(35um)、 6(70um)、8(105um)、10（140um） | ||
| Min BGA diamter | mil | 10(Flash gold 8mil) | 10(Flash gold 8mil) | ||
| AOI | Machine Capability | Orbotech SK-75 AOI | / | 0.05-6.0mm,max 23.5*23.5inch | 0.05-6.0mm,max 23.5*23.5inch |
| Orbotech Ves Machine | / | 0.05-6.0mm,max 23.5*23.5inch | 0.05-6.0mm,max 23.5*23.5inch | ||
| Dis covery 8200 AOI | / | 0.05-7.7mm,max26*31inch | 0.05-7.7mm,max26*31inch | ||
| Drilling | Machine Capability | NTL-DG2H\NTL-DG6H Drill machine | can process 2nd drill | 0.11-6.0mm，max size 22.4*26inch min Drill ￠0.15MM | 0.11-6.0mm，max size 22.4*26inch min Drill ￠0.15MM |
| MT-CNC2600 Drill machine | can process 2nd drill | 0.11-6.0mm，max size 18.5*26inch min Drill ￠0.20MM | 0.11-6.0mm，max size 18.5*26inch min Drill ￠0.20MM | ||
| Process Capability | Min slot drill bit size | mm | 0.5 | 0.5 | |
| Max aspect ratio for board thickness vs drill bit size | / | 12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review) | 12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review) | ||
| Hole location tolerance（Compare with CAD data） | mil | ±3 | ±3 | ||
| Counterbore hole | PTH & NPTH，Top angle 130 Degree，Top diameter <6.3mm | PTH & NPTH，Top angle 130 Degree，Top diameter <6.3mm | |||
| Min spacing from hole edge to conductive(Except for blind vias) | mil | 6(≤8 L),7(≤10 L),8(≤14 L),12(≤26 L) | 6(≤8 L),7(≤10 L),8(≤14 L),12(≤26 L) | ||
| Max drill bit size | mm | 6.3 | 6.3 | ||
| Max board thickness for 0.20mm drill bit size | mm | 2.5 | 2 | ||
| Min multi-hit slot width | mm | 0.45 | 0.45 | ||
| Hole size tolerance for press fit | mil | ±2 | ±2 | ||
| Min PTH Slot dimension tolerance | mm | ±0.15 | ±0.15 | ||
| Min NPTH slot dimension tolerance | mm | ±0.05 | ±0.05 | ||
| Drilling | Process Capability | Min spacing from hole edge to conductive(Blind vias) | mil | 8(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing) | 8(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing) |
| Max board thickness for 0.15mm mechanical drill | mm | 1.35(≤8 L) needs review | 1.2(≤8 L) needs review | ||
| Min hole size for laser drill | mm | 0.10(Depth ≤55um),0.13(Depth ≤80um，0.15(Depth ≤100um) | 0.10(Depth ≤55um),0.13(Depth ≤80um，0.15(Depth ≤100um) | ||
| Countersink hole angle & Diameter | Top 82，90，120 degree， diameter≤10mm needs review | Top 82，90，120 degree， diameter≤10mm needs review | |||
| Wet Process | Machine Capability | Panel & Pattern plating line | 0.20-7.0mm,max 24*30inch | 0.20-7.0mm,max 24*30inch | |
| Deburring Maching | 0.20-7.0mm,min 8*8inch | 0.20-7.0mm,min 8*8inch | |||
| Desmear Line | Can process 2nd desmear | 0.20-7.0mm,max 24*32in | 0.20-7.0mm,max 24*32in | ||
| Tin Plating Line | 0.20-3.2mm,max 24*30inch | 0.20-3.2mm,max 24*30inch | |||
| Process Capability | Min hole wall copper thickness | um | average 25,min≥20 | average 25,min≥20 | |
| Finished copper thickness(12um base copper) | um | ≥25 | ≥18 | ||
| Finished copper thickness(18um base copper) | um | ≥35(nominal thickness 52um、or 1.5Oz) | ≥35(nominal thickness 52um、or 1.5Oz) | ||
| Finished copper thickness(35um base copper) | um | ≥50(nominal thickness 65um) | ≥50(nominal thickness 65um) | ||
| Finished copper thickness(70um base copper) | um | ≥85 | ≥85 | ||
| Min Line width for ectching marking | mil | 8(12、18um)，10(35um)，12（70um） | 8(12、18um)，10(35um)，12（70um） | ||
| Max finished copper thickness for inner & Outer layers | / | 1OZ(350um)、≥6OZ needs review | 1OZ(350um)、≥6OZ needs review | ||
| Different copper thickness | / | 18/35、35/70(needs review) | 18/35、35/70(needs review) | ||
| Solder Mask | Machine Capability | Scrubbing Machine | / | 0.50-7.0mm,min：9*9inch | 0.50-7.0mm,min：9*9inch |
| Exposer | / | 0.11-7.0mm,max 25*32inch | 0.11-7.0mm,max 25*32inch | ||
| Develop Machine | / | 0.11-7.0mm,min 4*5inch | 0.11-7.0mm,min 4*5inch | ||
| Color | Solder Mask Color | / | Green, yellow, black, blue, red, white, matte green | Green, yellow, black, blue, red, white, matte green | |
| Solder Mask | Color | silkscreen Color | / | White,yellow,black,orange,gray | White,yellow,black,orange,gray |
| Solder Mask Capability | Min Solder Mask Opening（Clearance）(After Compensation) | mil | 2(Partial 1.5 for Flash Gold,others can partia 1)Only for18um & 35um | 2(Partial 1.5 for Flash Gold,others can partia 1)Only for18um & 35um | |
| Max plugged vias size | mm | 0.65mm for drill bit size | 0.5mm for drill bit size | ||
| Min width for line coverage by S/M | mil | 2mil per side,Only applies to 18um and 35um base copper | 2mil per side,Only applies to 18um and 35um base copper | ||
| Min solder mask legends width | mil | 8(min 7mil) | 8(min 7mil) | ||
| Min solder mask thickness | um | 8 | 8 | ||
| Solder mask thickness for via tenting | um | 10 | 10 | ||
| Min carbon oil line spacing | mil | 10 | 10 | ||
| Carbon oil/carbon oil min seclusion | mil | 14 | 14 | ||
| Carbon oil cover line min | mil | 2.5 | 2.5 | ||
| Carbon oil min line width | mil | 12 | 12 | ||
| Min Spacing from carbon pattern to pads | mil | 10mil、70um base copper≥12mil | 10mil、70um base copper≥12mil | ||
| Min width for peelable mask cover line/pads | mil | 6 | 6 | ||
| Min solder mask bridge width | mil | Base copper≤1OZ，Black,white & matte ink are 6mils, other inks are 4mils. Base coper 2-4OZ, min bridge width is 6mils. | Base copper≤1OZ，Black,white & matte ink are 6mils, other inks are 4mils. Base coper 2-4OZ, min bridge width is 6mils. | ||
| Solder Mask Hardness | H | 6 | 6 | ||
| Solder Mask | Peelable Mask Capability | Min spacing from peelable mask pattern to pads | mil | 12 | 12 |
| Max diameter for peelable mask tent hole (By screen printing) | mm | 2 | 2 | ||
| Max diameter for peelable mask tent hole (By Aluminum printing) | mm | 4.5 | 4.5 | ||
| Peelable mask thickness | mm | 0.2-0.5 | 0.2-0.5 | ||
| Component Mark Capability | Min Component mark line width and height(12、18um base copper) | / | Line width 4.5mil；Height：23mil | Line width 4.5mil；Height：23mil | |
| Min Component mark line width and height(35um Base copper) | / | Line width 5mil；Height：27mil | Line width 5mil；Height：27mil | ||
| Min Component mark line width and height(≥70um Base copper) | / | Line width 6mil, Height:45mil (State double printing on Lot Card) | Line width 6mil, Height:45mil (State double printing on Lot Card) | ||
| Min Spacing from legends to pads | mil | 7 | 7 | ||
| Surface Treatment | Surface Treatment Capability | Max Gold Finger Length | inch | 2 | 2 |
| Nickel Thickness For ENIG | um | 3-5UM | 3-5UM | ||
| Gold Thickness For ENIG | um | 0.025-0.10 | 0.025-0.10 | ||
| Nickel Thickness For Gold Finger | um | 3-5UM | 3-5UM | ||
| Gold Thickness For Gold Finger | um | 0.25-1.5 | 0.25-1.5 | ||
| Min Tin Thickness For HASL | um | 0.4(Copper Ground) | 0.4(Copper Ground) | ||
| HASL Machine | Can process 2nd HASL | 0.6-4.0mm,min 5*5；max 20*25inch | 0.6-4.0mm,min 5*5；max 20*25inch | ||
| Gold Finger surface treatment | Flash Gold/ENIG；Flash Gold/Hard Gold | Flash Gold/ENIG；Flash Gold/Hard Gold | |||
| gold thickness of Water gold board | u" | 1-5（Conventionality＞1u"） | 1-5（Conventionality＞1u"） | ||
| nickel thickness of Water gold board | u" | 120-250（Conventionality＞120u"） | 120-250（Conventionality＞120u"） | ||
| Immersion gold to OSP solder pad min distance | mil | 9mil | 9mil | ||
| Immersion Gold | 0.2-7.0mm，min 6*6in，max 21*27in | 0.2-7.0mm，min 6*6in，max 21*27in | |||
| Immersion Tin Thickness | um | 0.8-1.5 | 0.8-1.5 | ||
| Immersion Silver Thickness | um | 0.2-0.4um | 0.2-0.4um | ||
| OSP Thickness | um | 0.2-0.5 | 0.2-0.5 | ||
| E-Test | Machine Capability | Flying Probe Tester | 0.4-6.0mm,max 19.6*23.5inch | 0.4-6.0mm,max 19.6*23.5inch | |
| Min Spacing From Test Pad to Board Edge | mm | 0.5 | 0.5 | ||
| Min Conductive Resistance | Ω | 5 | 5 | ||
| Max Insulation Resistance | MΩ | 250 | 250 | ||
| Max Test Voltage | V | 500 | 500 | ||
| Min Test Pad Diameter | mil | 6 | 6 | ||
| Min Test Pad to Pad Spacing | mil | 10 | 10 | ||
| Max Test Current | mA | 200 | 200 | ||
| Profiling | Machine Capability | Profiling Type | / | NC Routing；V-CUT；Slot Tabs；Stamp Hole | NC Routing；V-CUT；Slot Tabs；Stamp Hole |
| NC Routing Machine | Can process 2nd Routing | 0.2-6.0mm,max 25.5*21.5inch | 0.2-6.0mm,max 25.5*21.5inch | ||
| V-CUT Machine | <0.6mm for one side only | 0.5-3.0mm, Max board width for v-cut:18inch | 0.5-3.0mm, Max board width for v-cut:18inch | ||
| Min Routing Bit Diameter | mm | 0.6 | 1 | ||
| Outline Tolerance(Line to Line) | mil | ±4(Complicated outline、slot need review) | ±4(Complicated outline、slot need review) | ||
| V-CUT Angle Type | 20°，30°，45°,60° | 20°，30°，45°,60° | |||
| Process Capability | V-CUT Angle Tolerance | o | ±5° | ±5° | |
| V-CUT Registration Tolerance | mil | ±4 | ±4 | ||
| Min Spacing from Conductive to V-cut line | mil | 12mil | 16mil | ||
| V-CUT Web Thickness Tolerance | mil | ±2 | ±2 | ||
| Min Gold Finger Spacing（After Compensation） | mil | 6 | 6 | ||
| Min Spacing to avoid gold finger tab bevelled | mm | 7(For Auto-Bevelling) | 7(For Auto-Bevelling) | ||
| Bevelling Angle Tolerance | / | ±5° | ±5° | ||
| Bevelling Remain Thickness Tolerance | mil | ±5 | ±5 | ||
| Min Inner Radius | mm | 0.4 | 0.4 | ||
| Min Spacing from Conductive to Outline | mil | 8 | 10 | ||
| Countersink or Counterbore Depth Tolerance | mm | ±0.2 | ±0.2 | ||
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