Xiao Bian tells you the development advantages of pcb level electroplating

Development advantages of pcb horizontal electroplating

The development of horizontal electroplating technology is not accidental, but the need for special functions of high-density, high-precision, multi-functional, high aspect ratio multilayer printed circuit board products is an inevitable result. Its advantages are that it is more advanced than the vertical hanging plating process currently used, the product quality is more reliable, and large-scale production can be achieved. Compared with the vertical electroplating process, it has the following advantages:

(1) It can adapt to a wide range of dimensions, without manual installation and hanging, and realize all automatic operations. It is extremely beneficial to improve and ensure that the operation process does not damage the surface of the substrate, and to achieve large-scale production.

(2) In the process review, there is no need to reserve the clamping position, increasing the practical area, and greatly saving the loss of raw materials.

(3) The whole process computer control is adopted for horizontal electroplating to ensure the uniformity of the coating on the surface and holes of each printed circuit board under the same conditions.

(4) From the management point of view, the cleaning of electroplating tank, the addition and replacement of electroplating solution can fully realize automatic operation, and will not cause management problems out of control due to human errors.

(5) It can be measured from the actual production that since the horizontal electroplating adopts multi-stage horizontal cleaning, the amount of cleaning water is greatly saved and the pressure of sewage treatment is reduced.

(6) As the system adopts closed operation, it can reduce the direct impact of pollution to the working space and heat evaporation on the process environment, and greatly improve the working environment. In particular, the unnecessary consumption of energy is saved and the production efficiency is greatly improved due to the reduction of heat loss during plate drying.

5、 Summary

The appearance of horizontal electroplating technology is completely to meet the needs of high aspect ratio through-hole electroplating. However, due to the complexity and particularity of electroplating process, there are still some technical problems in the design and development of electroplating system. This needs to be improved in practice.

However, the use of horizontal electroplating system is a great development and progress for the printed circuit industry. Because the application of this type of equipment in manufacturing high-density multilayer boards shows great potential. It can not only save manpower and operation time, but also produce faster and more efficiently than traditional vertical plating lines. It also reduces energy consumption, reduces waste liquid, waste water and waste gas to be treated, greatly improves process environment and conditions, and improves the quality level of electroplating layer. The horizontal electroplating line is suitable for 24-hour continuous operation with large-scale production. The horizontal electroplating line is slightly more difficult to debug than the vertical electroplating line. Once the debugging is completed, it is very stable. At the same time, the plating solution should be monitored at any time during use to adjust the plating solution to ensure long-term stable operation.

PCB manufacturers, PCB designers and PCBA processors will explain the development advantages of horizontal electroplating.