8-layer mechanical blind hole plate (4+4 mechanical blind hole structure)

Opening, drying board, mechanical drilling blind buried hole, copper sinking, full plate plating, inner graphics, plating holes, inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling, removing glue, drilling, normal process

6-layer mechanical blind hole plate (2+4 mechanical blind hole structure)

Opening, drying board, mechanical drilling of blind holes, copper sinking, full plate plating, inner graphics, plating hole plating, inner graphics, inner etching, inner AOI, brown chemical, laminating

6-layer mechanical blind hole plate (2+4 mechanical blind hole structure)

Floor L1-2:

Opening, drying board, mechanical drilling of blind holes, copper sinking, full plate plating, inner graphics, plating hole plating, inner graphics, inner etching, inner AOI, brown chemical, laminating

L3 minus 6 layers

Opening, drying board, mechanical drilling blind buried hole, copper plating, full plate plating, inner graphics, plating hole plating, inner graphics, inner etching, inner AOI, brown, laminating (L3-4 and L5-6 pressing), baking board, milling, removing glue, drilling, copper plating, full plate plating, inner graphics, plating hole plating, inner graphics, inner etching, inner AOI, brown, laminating (and L 1-2 laminated synthesis of 6 layers), baking board, edge milling, glue removal, drilling, normal process

6-layer second-order HDI board (1+1+N+1+1 structure)

Opening, drying board, mechanical drilling for buried holes, copper sinking, full plate plating (negative process, plating to the required copper thickness), inner graphics, inner etching, inner AOI, Browning, laminating, drying board, milling, drilling, copper sinking, full plate plating (negative process, plating to the required copper thickness), inner graphics, inner etching, Browning, laminating, drying board, milling, drilling, laser drilling, normal process

6-layer second-order HDI board (2+N+2 structure)

Opening, drying board, mechanical drilling of buried holes, copper sinking, full plate plating (negative process, plating to the required copper thickness), inner graphics, inner etching, inner AOI, brown, laminating (L2-5 laminating), baking board, milling, drilling, laser drilling, copper sinking, full plate plating (negative process, plating to the required copper thickness), inner graphics, inner etching, brown, laminating, drying board, milling edge Drilling, laser drilling, normal process

8-layer mechanical blind buried hole plate (2+2+2+2 mechanical blind buried hole structure)

Opening, drying board, mechanical drilling blind buried hole, copper sinking, full plate plating, inner graphics, plating holes, inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling, removing glue, drilling, normal process

8-layer mechanical blind hole plate (4+4 mechanical blind hole structure)

Opening, drying board, inner graphics, inner etching, inner AOI, brown, laminating (pressed synthesis of 1-4 layers and 5-8 layers), milling, drilling, copper sinking, full plate plating, inner graphics, plating holes, inner graphics, inner etching, brown, laminating, drying board, milling, removing glue, drilling, normal process

8-layer first-order HDI board (first-order laser drilling structure + mechanical drilling buried holes)

Opening, baking board, inner graphic, inner etching, inner AOI, Browning, laminating (pressing 2-7 layers), milling, drilling, copper sinking, full plate plating (negative film process, plating to required copper thickness), inner graphic, inner etching, inner AOI, Browning, laminating (pressing 1-8 layers), baking board, milling, drilling, normal flow

8-layer second-order HDI plate (1+1+N+1+1 +1 with mechanical blind hole structure)

Opening, baking board (4-5 layers), inner graphic, inner etching, inner AOI, brown, laminating (pressing 3-6 layers), milling, drilling, copper plating, full plate plating (negative process, plating to required copper thickness), inner graphic, inner etching, inner AOI, brown plating, laminating (pressing 2-7 layers), baking board, milling, drilling, laser drilling, copper plating, full plate plating (negative film process, plating to required copper thickness), inner graphics, inner etching, inner AOI, brown, laminating (pressing 1-8 layers), baking plate, edge milling, drilling, laser drilling, normal process

Design principle of laminated structure of blind buried plate

For all first-order blind holes with 0.10mm core plate thickness and aperture less than 0.25mm, use 100um RCC; for all blind holes with 0.13mm core plate thickness and aperture less than 0.25mm, customers are advised to use 100T RCC

2 For the blind buried hole plates of N+ structure, the laminated structure design should follow the same or similar thickness (thickness difference is less than 0.20mm). When the thickness of medium layer in the N or M laminated structure is greater than or equal to 0.40mm, the inner core plate should be used instead. For the blind buried hole plates of multiple compacted, the matching thickness of the last compacted thickness must be considered in the design.

3 For blind hole electroplating control copper thickness please engineering remarks: average 20um, single point greater than 18um.