With the continuous improvement of electronic communication technology, more and more traditional circuit board manufacturing methods have been far from meet the rapid development of this era, want to really fast production of high precision, good perform
Rapid PCB fabrication is a technique that allows you to make hardware development as easy as software development. Master it, can get twice the result with half the effort.
the degree of automation of industrial equipment is getting higher and higher, so the number of industrial control board in various industries is also increasing. After the industrial control board is damaged, the high cost required to replace the circuit
The chemical residue in the gold settling process can be left in the hole where the plug hole is not sufficient, causing problems such as weldability. Moreover, tin beads may be hidden in the hole, which may splash out during assembly or actual use, causi
To prolong the life of devices and prevent failures, effective heat transfer management is very important. Overheating conditions on the board can not only speed up the failure mechanism, but also cause the device to become too hot to handle and in some c
There is no doubt that condensation will severely test the insulation resistance of the coating. There are many coating products that can withstand this kind of test, so you can avoid these problems by choosing the right materials at the beginning of the
its melting point is much higher than that of the tin solder, which results in the reduction of the weldability of the surface of the welding pad, and the non-wetting of the welding pad and the solder climbing to the welding end of the device are easy to
A total of four BGA were dyed. After the BGA was pulled apart, it could be seen that most of the solder joints were pulled apart from the joint of PCB pad and substrate, and some were pulled apart from the side of pad, but there were holes.
The PCB thermal cycle temperature is summarized in Table 1 below according to the five grades classified according to the different position of the vehicle.
Special attention needs to be paid to the selection of materials to ensure stability in terms of temperature, humidity and bias in addition to electrical properties. This will lead to future restrictions on material selection and design rules.
the process of resin plug hole has been used more and more widely in the PCB industry, especially in some high layer, the board thickness of the product is favored. It was hoped that the use of resin plug holes would solve a range of problems that could n
The appearance of poor tin pcb is generally related to the cleanliness of PCB empty board surface. If there is no pollution, there will be no poor tin. Second, the solder itself is poor, temperature and so on.
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