Communication PCBA

//Communication PCBA

Communication PCBA, It is mainly used in all communication electronic products.

  • Product Description tems Capability 1 PCB assembly min IC pitch 0.30mm (12mil) 2 PCB assembly foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA 3 PCB assembly min chip placement 01005 4 PCB Assembly Max PCB Size 410 x 600mm (16.2 x 23.6″) 5 PCB assembly min PCB thickness 0.35mm (13.8mil) 6 PCB assembly maximum BGA size 74 x 74mm (2.9 x 2.9″) 7 PCB assembly BGA ball pitch 1-3mm (4-12mil) 8 PCB assembly BGA ball diameter 0.4-1mm (16-40mil) 9 PCB assembly QFP lead pitch 0.38-2.54mm (15-100mil) 10 PCB assembly packing Anti-static bubble bag and carton Key Specifications/Special Features: 1.Product description PCBA manufacturing for OEM, OEM 2.PCB assembly with testing 3.Circuit boards with 1 to 22 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing 4.Conventional coating for preventing humidity 5.Consigned brand active and passive components sourcing is directly from original manufacturer and agent by our overseas purchase Experienced technical staff approves passive components, connector, IC, diode and transistor replacement 6.High precision 0201, 0402.0603, fine pitch QFP, BGA, bonding size components SMT technology and lead free RoHS technology 7.Related certifications – UL, ISO 9001, ISO 14001 and meet RoHS Directive standard 8.Our building products experience range: home appliance, consumer electronics, industrial, automotive, medical, computing, storage, instrumentation, traffic, industrial power, battery, fire alarm, CCTV, wireless communication, telecommunication, networking, printer
  • Communicate pcb assembly Communicate pcb assembly
    Product Description tems Capability 1 PCB assembly min IC pitch 0.30mm (12mil) 2 PCB assembly foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA 3 PCB assembly min chip placement 01005 4 PCB Assembly Max PCB Size 410 x 600mm (16.2 x 23.6″) 5 PCB assembly min PCB thickness 0.35mm (13.8mil) 6 PCB assembly maximum BGA size 74 x 74mm (2.9 x 2.9″) 7 PCB assembly BGA ball pitch 1-3mm (4-12mil) 8 PCB assembly BGA ball diameter 0.4-1mm (16-40mil) 9 PCB assembly QFP lead pitch 0.38-2.54mm (15-100mil) 10 PCB assembly packing Anti-static bubble bag and carton Key Specifications/Special Features: 1.Product description PCBA manufacturing for OEM, OEM 2.PCB assembly with testing 3.Circuit boards with 1 to 22 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing 4.Conventional coating for preventing humidity 5.Consigned brand active and passive components sourcing is directly from original manufacturer and agent by our overseas purchase Experienced technical staff approves passive components, connector, IC, diode and transistor replacement 6.High precision 0201, 0402.0603, fine pitch QFP, BGA, bonding size components SMT technology and lead free RoHS technology 7.Related certifications – UL, ISO 9001, ISO 14001 and meet RoHS Directive standard 8.Our building products experience range: home appliance, consumer electronics, industrial, automotive, medical, computing, storage, instrumentation, traffic, industrial power, battery, fire alarm, CCTV, wireless communication, telecommunication, networking, printer
  • pcba communication decoder pcba communication decoder pcb
    Product Description tems Capability 1 PCB assembly min IC pitch 0.30mm (12mil) 2 PCB assembly foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA 3 PCB assembly min chip placement 01005 4 PCB Assembly Max PCB Size 410 x 600mm (16.2 x 23.6″) 5 PCB assembly min PCB thickness 0.35mm (13.8mil) 6 PCB assembly maximum BGA size 74 x 74mm (2.9 x 2.9″) 7 PCB assembly BGA ball pitch 1-3mm (4-12mil) 8 PCB assembly BGA ball diameter 0.4-1mm (16-40mil) 9 PCB assembly QFP lead pitch 0.38-2.54mm (15-100mil) 10 PCB assembly packing Anti-static bubble bag and carton Key Specifications/Special Features: 1.Product description PCBA manufacturing for OEM, OEM 2.PCB assembly with testing 3.Circuit boards with 1 to 22 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing 4.Conventional coating for preventing humidity 5.Consigned brand active and passive components sourcing is directly from original manufacturer and agent by our overseas purchase Experienced technical staff approves passive components, connector, IC, diode and transistor replacement 6.High precision 0201, 0402.0603, fine pitch QFP, BGA, bonding size components SMT technology and lead free RoHS technology 7.Related certifications – UL, ISO 9001, ISO 14001 and meet RoHS Directive standard 8.Our building products experience range: home appliance, consumer electronics, industrial, automotive, medical, computing, storage, instrumentation, traffic, industrial power, battery, fire alarm, CCTV, wireless communication, telecommunication, networking, printer