Industrial PCBA

//Industrial PCBA

Industrial PCBA, It is mainly used in all industrial electronic products.

  • pcb assembly industrial-pcb-assembly
    Key Specifications/Special Features:   1.Product description PCBA manufacturing for OEM, OEM 2.PCB assembly with testing 3.Circuit boards with 1 to 22 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing 4.Conventional coating for preventing humidity 5.Consigned brand active and passive components sourcing is directly from original manufacturer and agent by our overseas purchase Experienced technical staff approves passive components, connector, IC, diode and transistor replacement 6.High precision 0201, 0402.0603, fine pitch QFP, BGA, bonding size components SMT technology and lead free RoHS technology 7.Related certifications – UL, ISO 9001, ISO 14001 and meet RoHS Directive standard 8.Our building products experience range: home appliance, consumer electronics, industrial, automotive, medical, computing, storage, instrumentation, traffic, industrial power, battery, fire alarm, CCTV, wireless communication, telecommunication, networking, printer Items Capability 1 PCB assembly min IC pitch 0.30mm (12mil) 2 PCB assembly foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA 3 PCB assembly min chip placement 01005 4 PCB Assembly Max PCB Size 410 x 600mm (16.2 x 23.6″) 5 PCB assembly min PCB thickness 0.35mm (13.8mil) 6 PCB assembly maximum BGA size 74 x 74mm (2.9 x 2.9″) 7 PCB assembly BGA ball pitch 1-3mm (4-12mil) 8 PCB assembly BGA ball diameter 0.4-1mm (16-40mil) 9 PCB assembly QFP lead pitch 0.38-2.54mm (15-100mil) 10 PCB assembly packing Anti-static bubble bag and carton
  • Industrial pcb assembly Industrial-pcb-assembly
    Product Description -Lead free HASL surface finish compliant ROHS required -4-layer PCB -FR4 1.6T 1OZ -20up V-cut panel routing(CNC) -Surface finish: OSP, HAL, Immersion Gold, Gold finger and lead free HASL -solder mask color: Matt Green -min finished hole size with 0.2mm PCB assembly Capability 1. Min IC pitch 0.30mm (12mil) 2. Foot pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA 3. Min chip placement 01005 4. Max PCB Size 410 x 980mm 5. Min PCB thickness 0.35mm (13.8mil) 6. Maximum BGA size 74 x 74mm (2.9 x 2.9″) 7. BGA ball pitch 1-3mm (4-12mil) 8. BGA ball diameter 0.4-1mm (16-40mil) 9. QFP lead pitch 0.38-2.54mm (15-100mil) 10. Packing Anti-static bubble bag and carton  
  • pcba communication decoder pcb Industrial-pcb-assembly
    Product Description - Lead free HASL surface finish compliant ROHS requied -4-layer PCB -FR4 1.6T 1OZ -20up V-cut panel routing(CNC) -Surface finsih: OSP, HAL, Immersion Gold, Gold finger and lead free HASL -solder mask color: Green, red, white, yellow and red -min finished hole size with 0.2mm   Packaging & Delivery Packaging Details One pcs in one bubble pack Delivery Time Within 2~3 weeks after deposit Specifications PCBA Assembly OEM Electronic Controller ROHS certificate; PCB copy,design,assembly,testing,one stop service; PCBA Assembly OEM Electronic Controller