14 Layers HDI PCB
Layer No: 14 layer
Panel size/mm: 82mm*105mm
Material: FR4;High TG
Finished Thickess: 1.6mm
Finished Copper: Inner12um/Outer35um
Surface treatment: ENIG
Special Technology: Gold Finger
Kingford-18 years PCB&PCBA experiences,your turnkey partner from China. With over 12 SMT lines and 60 equipment, we can assure 100% timely delivery.
PCB Manufacturing Capacity:
Base material:FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc
PCBs: Rigid(0-22layers),Flexible(1-8layers),Rigid-flex(1-16layers,flex 8layers), MCPCB(aluminum and copper1-4layers)
Board thickness: 0.2mm–10mm
Copper thickness: 0.25 Oz -8 Oz
Max Panel Size: 1500 mm × 560 mm
Min. Hole Size: 0.075mm(3mil)
Min. Line Width/Spacing: 3mil
Surface Finishing: HASL/HAL, HASL Lead Free,ENIG,immersion silver,immersion tin,OSP,Plating Hard Gold,etc.
Solder Mask Color: White, Black, Yellow, Green, Red, etc.
Silkscreen Color: Black, White, Yellow, Red, Blue, etc.
Special Process: Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.
PCB Assembly Capacity:
SMT Capability:5KK points/Day,single-sided/double-sided,10 Lines
Reject rate of components: 0.3% (Capacitor and Resistance)No(IC)
Min. Package: 01005 chip / 0.35 Pitch BGA
Min. Precision: +/-0.04mm
Min. Precison of IC: +/-0.03mm
Max. Height of components by machine:30mm
Min. Pin pitch of SMT: 0.2mm
Min. Ball pitch of SMT: 0.2mm
Min. Precision of Stencil: 5um
PCB Size of Assembly: 5x5mm-500*1500mm
PCB Thickness of Assembly: 0.1-10mm
BGA/μBGA: available;Solder paste/glue processing
DIP capacity: 0.30 million points per day
Max. Capability: Stable support for 200 products on production line at the same time
Functional testing&Casing assembly: upon customer’s requirements