Double Layer Telecommunications Aluminum PCB

///Double Layer Telecommunications Aluminum PCB

Double Layer Telecommunications Aluminum PCB

Double Layer Telecommunications Aluminum PCB

General Specification:

Layer No : 2 layer
Unit size/mm :102mm*102mm
Material : Aluminum
Finished Thickess :1.6mm
Finished Copper : 35um
Surface treatment : ENIG
Soldermask: White
Silkscreen:Black

Description

Double Layer Telecommunications Aluminum PCB

General Specification:

Layer No : 2 layer
Unit size/mm :102mm*102mm
Material : Aluminum
Finished Thickess :1.6mm
Finished Copper : 35um
Surface treatment : ENIG
Soldermask: White
Silkscreen:Black

Our Implementing Strict Quality Control System:

•UL-recognized
•Automatic optical inspection
•100% open short testing
•IPC A-600G
•ISO 9001-,ISO 14001-, ISO/TS 16949,ISO13485,IATF-16949,OHSAS18001certified
•Statistical Process Control (SPC)
•Impedance control

Services and Support:

•Customer Services: On line Email/Telephone/EC provides customer 24-hour services;Great pre-sales, sales,after-sales services
•Sample Availability & Policy: Sample quotation within three days;the sample be finished within one week.
•Guarantees/Warranties/Terms and Conditions: We guarantee pre-payment.
•Export/Import Processing Support: Our export and import support service are EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express
•After Sales Service: For all problems encountered kindly contact us, we will do the after service any time.

PCB Manufacturing Capacity:

Base material:FR-4/CEM-1/CEM3/Ceramic/Teflon/Aluminum/Copper etc
PCBs: Rigid(0-22layers),Flexible(1-8layers),Rigid-flex(1-16layers,flex 8layers), MCPCB(aluminum and copper1-4layers)
Board thickness: 0.2mm–10mm
Copper thickness: 0.25 Oz -8 Oz
Max Panel Size: 1500 mm × 560 mm
Min. Hole Size: 0.075mm(3mil)
Min. Line Width/Spacing: 3mil
Surface Finishing: HASL/HAL, HASL Lead Free,ENIG,immersion silver,immersion tin,OSP,Plating Hard Gold,etc.
Solder Mask Color: White, Black, Yellow, Green, Red, etc.
Silkscreen Color: Black, White, Yellow, Red, Blue, etc.
Special Process: Buried hole, blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.

PCB Assembly Capacity:

SMT Capability:5KK points/Day,single-sided/double-sided,10 Lines
Reject rate of components: 0.3% (Capacitor and Resistance)No(IC)
Min. Package: 01005 chip / 0.35 Pitch BGA
Min. Precision: +/-0.04mm
Min. Precison of IC: +/-0.03mm
SMD Size:0201-150mm
Max. Height of components by machine:30mm
Min. Pin pitch of SMT: 0.2mm
Min. Ball pitch of SMT: 0.2mm
Min. Precision of Stencil: 5um
PCB Size of Assembly: 5x5mm-500*1500mm
PCB Thickness of Assembly: 0.1-10mm
BGA/μBGA: available;Solder paste/glue processing
DIP capacity: 0.30 million points per day
Max. Capability: Stable support for 200 products on production line at the same time
Functional testing&Casing assembly: upon customer’s requirements

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