Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13923401642Mon.-Sat.08:00-20:00
Thick Copper PCB Capability | |
Feature | Capability |
Material | FR-4 Standard Tg 140°C, FR4-High Tg 170°C |
Min. Track/Spacing | For External layers: 4oz Cu 10mil/13mil,5oz Cu 12mil/15mil 6oz Cu 15mil/15mil |
For Internal layers: 4oz Cu 8mil/8mil,5oz Cu 10mil/10mil 6oz Cu 12mil/12mil | |
Min. Hole Size | 0.15 ~ 0.3mm |
Max Outer Layer Copper Weight (Finished) | 13oz |
Max Inner Layer Copper Weight | 12oz |
Board Thickness | 0.6-6mm |
Surface Finishing | HASL lead free,Immersion gold, OSP, Hard Gold,Immersion Silver,Enepig |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
Silkscreen | White, Black |
Via Process | Tenting Vias,Plugged Vias,Vias not covered |
Testing | Fly Probe Testing (Free) and A.O.I. testing |
Build time | 5-15 days |
Lead time | 2-3 days |
Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.